Accelerator surface phase associated with superconformal Cu electrodeposition

Journal of the Electrochemical Society

Volumn 157, Issue 4, 2010, Pages

  Moffat, T P ^a   Ou Yang, L Y ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE CONCENTRATIONS; ADDITIVE FUNCTION; ADLAYERS; CO-ADSORPTION; CU ELECTROPLATING; CU METALLIZATION; CU(1 0 0); DERIVED SPECIES; DIRECT ACCESS; ELECTROLYTE ADDITIVES; ELECTRONIC DEVICE; EXPOSURE-TIME; IMAGING CONDITIONS; IN-SITU SCANNING TUNNELING MICROSCOPIES; KEY PROCESS; LATTICE GAS; MOLECULE INTERACTIONS; NEGATIVE POTENTIAL; SODIUMSULFOPROPYL; SULFIDE FORMATION; SUPERCONFORMAL FILM GROWTH; SUPERFILLING; SURFACE FEATURE; SURFACE PHASE; TUNNELING CURRENT; TWO-DIMENSIONAL GAS;

ADDITIVES; COPPER; DESORPTION; ETHYLENE; ETHYLENE GLYCOL; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SCANNING TUNNELING MICROSCOPY; SURFACE ACTIVE AGENTS; TWO DIMENSIONAL; VAPOR DEPOSITION; WIND TUNNELS;

FILM GROWTH;

EID: 77949762931     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3298852     Document Type: Conference Paper

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