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Volumn 156, Issue 8, 2009, Pages

Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION TIME; BIS(3-SULFOPROPYL)DISULFIDE; COPPER PLATING BATHS; FILLING RATE; POLYPROPYLENE GLYCOL; SIMPLE EXPRESSION; STRONG CORRELATION; TIME-SCALE; TRIBLOCK COPOLYMERS;

EID: 67650609767     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3142422     Document Type: Article
Times cited : (54)

References (37)
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    • K. R. Hebert, J. Electrochem. Soc. 0013-4651, 148, C726 (2001). 10.1149/1.1408634
    • (2001) J. Electrochem. Soc. , vol.148 , pp. 726
    • Hebert, K.R.1
  • 14
    • 0038608146 scopus 로고    scopus 로고
    • 0013-4651. 10.1149/1.1570412
    • M. Tan and J. N. Harb, J. Electrochem. Soc. 0013-4651, 150, C420 (2003). 10.1149/1.1570412
    • (2003) J. Electrochem. Soc. , vol.150 , pp. 420
    • Tan, M.1    Harb, J.N.2
  • 16
    • 0033906753 scopus 로고    scopus 로고
    • 0013-4651. 10.1149/1.1393179
    • A. C. West, J. Electrochem. Soc. 0013-4651, 147, 227 (2000). 10.1149/1.1393179
    • (2000) J. Electrochem. Soc. , vol.147 , pp. 227
    • West, A.C.1
  • 37


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.