|
Volumn 151, Issue 11, 2004, Pages
|
A time-dependent transport-kinetics model for additive interactions in copper interconnect metallization
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CATALYSIS;
COPPER;
CURRENT DENSITY;
ELECTRODEPOSITION;
ELECTRODES;
ELECTROLYTES;
POLARIZATION;
POLYETHYLENE GLYCOLS;
REACTION KINETICS;
SECONDARY ION MASS SPECTROMETRY;
DAMASCENE;
REFERENCE ELECTRODES;
SIDEWALLS;
TRANSIENT EFFECTS;
METALLIZING;
|
EID: 10944220200
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1799431 Document Type: Article |
Times cited : (148)
|
References (14)
|