Self-assembly of organic monolayers as protective and conductive bridges for nanometric surface-mount applications

ACS Applied Materials and Interfaces

Volumn 2, Issue 9, 2010, Pages 2585-2593

  Platzman, Ilia ^a   Haick, Hossam ^a   Tannenbaum, Rina ^a,b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b Georgia Institute of Technology   (United States)

Author keywords

1,4 phenylene diisocyanide (PDI); copper; molecular electronics; self assembled monolayer; surface mount technology; terephthalic acid (TPA)

Indexed keywords

ADHESIVE LAYERS; CU SUBSTRATE; CU SURFACES; DIISOCYANIDE; ELECTRICAL CONDUCTIVITY; ELECTRICAL JUNCTIONS; FABRICATION METHOD; MOLECULAR BRIDGES; MOLECULAR WIRES; NANOMETRIC SCALE; NANOMETRICS; NOVEL PROCESS; NOVEL SURFACES; ONE-TERMINAL; ORGANIC MONOLAYERS; PARALLEL PLATES; PHASE CONFORMATIONS; PLACEMENT PROCESS; PRINTING TECHNOLOGIES; SAMS; STANDING-UP; SURFACE COVERAGES; TEREPHTHALIC ACIDS; TERMINAL GROUPS; THERMALLY STABLE; TUNNELING EFFICIENCY;

AROMATIC COMPOUNDS; ELECTRIC CONDUCTIVITY; ELECTRON ENERGY LEVELS; FUNCTIONAL GROUPS; MOLECULAR ELECTRONICS; MOLECULES; MOUNTINGS; ORGANIC POLYMERS; SUBSTRATES;

SELF ASSEMBLED MONOLAYERS;

NANOPARTICLE; ORGANIC COMPOUND;

ARTICLE; CHEMISTRY; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTRONICS; INSTRUMENTATION; MATERIALS TESTING; METHODOLOGY; PARTICLE SIZE; RADIATION EXPOSURE; SURFACE PROPERTY;

CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTRONICS; MATERIALS TESTING; NANOPARTICLES; ORGANIC CHEMICALS; PARTICLE SIZE; SURFACE PROPERTIES;

EID: 79151481780     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am100427a     Document Type: Article

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