Formation of ultrasmooth and highly stable copper surfaces through annealing and self-assembly of organic monolayers

Langmuir

Volumn 26, Issue 1, 2010, Pages 191-201

  Platzman, Ilia ^a   Saguy, Cecile ^b   Brener, Reuven ^b   Tannenbaum, Rina ^a,b,c   Haick, Hossam ^a,b  

^a Department of Chemical Engineering ^*

^b TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^c Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION LAYER; AMBIENT AIR CONDITIONS; BEFORE AND AFTER; COPPER SURFACE; CU OXIDE; CU SURFACES; CU-BASED; ELECTROMIGRATION RESISTANCE; ELECTRONIC DEVICE; INTERCONNECT MATERIALS; MICRO-ELECTRONIC DEVICES; MORPHOLOGICAL PROPERTIES; ORGANIC MONOLAYERS; OXIDATION BEHAVIORS; OXIDATION MECHANISMS; PHASE CONFIGURATIONS; POLYCRYSTALLINE; POTENTIAL VALUES; PROTECTION EFFICIENCY; STANDING-UP; TANTALUM NITRIDES; TEREPHTHALIC ACIDS;

ANNEALING; CHEMICAL MODIFICATION; COATINGS; ELECTRON ENERGY LEVELS; LUMINESCENCE OF ORGANIC SOLIDS; MICROELECTRONICS; NITRIDES; OXIDATION; SELF ASSEMBLED MONOLAYERS; SURFACES; TANTALUM; TANTALUM COMPOUNDS;

COPPER;

EID: 73649142728     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la902006v     Document Type: Article

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