Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol

Applied Surface Science

Volumn 252, Issue 2, 2005, Pages 400-411

  Hutt, David A ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Alkanethiol; Copper; Octadecanethiol; Oxidation; Self assembled monolayers; Temperature

Indexed keywords

ALCOHOLS; CORROSION; ETCHING; MONOLAYERS; OXIDATION; PROTECTION; SELF ASSEMBLY; SUBSTRATES; THERMAL EFFECTS; X RAY PHOTOELECTRON SPECTROSCOPY;

ALKANETHIOLS; COPPER SURFACES; OCLADECANETHIOLS (ODT); OXIDATION PROTECTION; OXIDE LAYERS;

COPPER;

EID: 24644508483     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.01.019     Document Type: Article

References (53)

1. C.D. Bain, E.B. Troughton, Y.-T. Tao, J. Evall, G.M. Whitesides, and R.G. Nuzzo J. Am. Chem. Soc. 111 1989 321 335
2. C.D. Bain, J. Evall, and G.M. Whitesides J. Am. Chem. Soc. 111 1989 7155 7164
3. C.D. Bain, and G.M. Whitesides J. Am. Chem. Soc. 111 1989 7164 7175
4. J.P. Folkers, P.E. Laibinis, and G.M. Whitesides Langmuir 8 1992 1330 1341
5. P.E. Laibinis, R.G. Nuzzo, and G.M. Whitesides J. Phys. Chem. 96 1992 5097 5105
6. P.E. Laibinis, M.A. Fox, J.P. Folkers, and G.M. Whitesides Langmuir 7 1991 3167 3173
7. A. Kumar, H.A. Biebuyck, and G.M. Whitesides Langmuir 10 1994 1498 1511
8. H. Kind, A.M. Bittner, O. Cavalleri, K. Kern, and T. Greber J. Phys. Chem. B 102 1998 7582 7589
9. E. Cooper, R. Wiggs, D.A. Hutt, L. Parker, G.J. Leggett, and T.L. Parker J. Mater. Chem. 7 1997 435 441
10. C.B. Gorman, H.A. Biebuyck, and G.M. Whitesides Chem. Mater. 7 1995 252 254
11. P.E. Laibinis, G.M. Whitesides, D.L. Allara, Y.-T. Tao, A.N. Parikh, and R.G. Nuzzo J. Am. Chem. Soc. 113 1991 7152 7167
12. P.E. Laibinis, and G.M. Whitesides J. Am. Chem. Soc. 114 1992 1990 1995
13. R. Tremont, and C.R. Cabrera J. Appl. Electrochem. 32 2002 783 793
14. P.E. Laibinis, and G.M. Whitesides J. Am. Chem. Soc. 114 1992 9022 9028
15. G.K. Jennings, J.C. Munro, T.-H. Yong, and P.E. Laibinis Langmuir 14 1998 6130 6139
16. G.K. Jennings, and P.E. Laibinis J. Am. Chem. Soc. 119 1997 5208 5214
17. F.P. Zamborini, J.K. Campbell, and R.M. Crooks Langmuir 14 1998 640 647
18. F. Laffineur, J. Delhalle, S. Guittard, S. Geribaldi, and Z. Mekhalif Colloids Surfaces A 198-200 2002 817 827
19. M.M. Sung, and Y. Kim Bull. Korean Chem. Soc. 22 2001 748 752
20. Z. Mekhalif, A. Lazarescu, L. Hevesi, J.-J. Pireaux, and J. Delhalle J. Mater. Chem. 8 1998 545 551
21. Z. Mekhalif, F. Laffineur, N. Couturier, and J. Delhalle Langmuir 19 2003 637 645
22. R. Haneda, and K. Aramaki J. Electrochem. Soc. 145 1998 1856 1861
23. R. Haneda, and K. Aramaki J. Electrochem. Soc. 145 1998 2786 2791
24. M. Ishibashi, M. Itoh, H. Nishihara, and K. Aramaki Electrochim. Acta 41 1996 241 248
25. J. Scherer, M.R. Vogt, O.M. Magnussen, and R.J. Behm Langmuir 13 1997 7045 7051
26. Y. Feng, W.-K. Teo, K.-S. Siow, Z. Gao, K.-L. Tan, and A.-K. Hsieh J. Electrochem. Soc. 144 1997 55 64
27. N. Koopman, and S. Nangalia J. Lau Low Cost Flip Chip Technologies 1996 McGraw-Hill 83 119
28. J.D. DeBiase Proceedings of Surface Mount International Advanced Electronic Manufacturing Technologies Conference, vol. 2 San Jose, USA 1996 763 776
29. N.R. Sorensen, and F.M. Hosking Advances in electronic packaging Proceedings of the International Electronic Packaging Conference (InterPack), vol. 10 1995 1101 1105
30. R.L. Opila, H.W. Krautter, B.R. Zegarski, L.H. Dubois, and G. Wenger J. Electrochem. Soc. 142 1995 4074 4077
31. C. Liu, and D.A. Hutt Circuit World 29 2002 19 23
32. C. Liu, D.A. Hutt, Submitted to IEEE Trans. Components Packaging Technol.
33. A.J. Wagner, S.R. Carlo, C. Vecitis, and D.H. Fairbrother Langmuir 18 2002 1542 1549
34. R.G. Nuzzo, L.H. Dubois, and D.L. Allara J. Am. Chem. Soc. 112 1990 558 569
35. R. Kwok, Department of Chemistry, Chinese University of Hong Kong, XPSPEAK Version 4.1 software.
36. J. Huang, and J.C. Hemminger J. Am. Chem. Soc. 115 1993 3342 3343
37. M.J. Tarlov, D.R.F. Burgess, and G. Gillen J. Am. Chem. Soc. 115 1993 5305 5306
38. H. Ron, H. Cohen, S. Matlis, M. Rappaport, and I. Rubinstein J. Phys. Chem. B 102 1998 9861 9869
39. P.E. Laibinis, C.D. Bain, and G.M. Whitesides J. Phys. Chem. 95 1991 7017 7021
40. S.L. Qiu, X. Pan, M. Strongin, and P.H. Citrin Phys. Rev. B 36 1987 1292 1295
41. S. Raaen, and N.A. Braaten Phys. Rev. B 42 1990 9151 9154
42. C. Lea Soldering Surf. Mount Technol. 4 1990 8 13
43. C. Lea, and W.A. Dench Soldering Surf. Mount Technol. 4 1990 14 22
44. C. Lea Soldering Surf. Mount Technol. 5 1990 46 55
45. C. Lea Soldering Surf. Mount Technol. 6 1990 4 9
46. D.A. Hutt, and G.J. Leggett J. Phys. Chem. 100 1996 6657 6662
47. D.A. Hutt, E. Copper, and G.J. Leggett J. Phys. Chem. 102 1998 174 184
48. E. Cooper, and G.J. Leggett Langmuir 14 1998 4795 4801
49. E. Cooper, and G.J. Leggett Langmuir 15 1999 1024 1032
50. N. Camillone, C.E.D. Chidsey, G.-Y. Liu, T.M. Putvinski, and G. Scoles J. Chem. Phys. 94 1991 8493 8502
51. P. Fenter, P. Eisenberger, and K.S. Liang Phys. Rev. Lett. 70 1993 2447 2450
52. R.G. Nuzzo, E.M. Korenic, and L.H. Dubois J. Chem. Phys. 93 1990 767 773
53. R. Bhatia, and B.J. Garrison Langmuir 13 1997 765 769