Simulation of structure evolution in Cu films

Thin Solid Films

Volumn 517, Issue 6, 2009, Pages 1977-1982

  Chung, Chia Jeng ^a   Field, David P ^a   Park, No Jin ^b   Johnson, Ross G ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b Kumoh National Institute of Technology   (South Korea)

Author keywords

Copper; Electron backscatter diffraction; Grain growth; Monte Carlo modeling

Indexed keywords

BACKSCATTERING; COPPER; CRYSTAL GROWTH; DIFFRACTION; ELECTRON DIFFRACTION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH (MATERIALS); MAGNETIC FILMS; MATHEMATICAL MODELS; METALLIC FILMS; MODEL STRUCTURES; MONTE CARLO METHODS; VACANCIES;

ANNEALING CONDITIONS; CRYSTALLOGRAPHIC TEXTURES; CU FILMS; ELASTIC STRAIN ENERGIES; ELECTRON BACKSCATTER DIFFRACTION; FILM STRUCTURES; LATTICE ORIENTATIONS; MICROSTRUCTURAL; MONTE CARLO MODELING; MONTE CARLO SIMULATIONS; STRUCTURE EVOLUTIONS;

GRAIN GROWTH;

EID: 58149086401     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.11.068     Document Type: Article

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