A novel measurement technique for stencil printed solder paste

Soldering and Surface Mount Technology

Volumn 15, Issue 2, 2003, Pages 35-45

  Dušek, Miloš ^a   Hunt, Christopher ^a  

^a NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Defects; Measurement; Solder pastes

Indexed keywords

ALGORITHMS; DEFECTS; PRINTING; SURFACE MOUNT TECHNOLOGY; SURFACE PROPERTIES;

SOLDER PASTES;

SOLDERING ALLOYS;

EID: 0038266795     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310479512     Document Type: Article

References (5)

1. Barajas, L., Kamen, E. and Goldstein, A. (2001), "On-line enhancement of the stencil printing process", Circuits Assembly, pp. 32-6.
2. Gunn, R. (2002), "Implementing total in-line solder paste inspection", SMT Magazine, pp. 112-4.
3. Houston, P.N., Lewis, B.J., Smith, B.A. and Baldwin, D.F. (2001), "High speed 0201 processing and characterization", Proceedings of the IPC SMEMA Council APEX SM 2001, pp. MP5-3 1-8.
4. Hunt, C. (1998), "Measuring stencil printed solder paste", NPL Report CMMT(A)127, ISSN 1361-4061, Teddington.
5. Lathrop Jr, R.R. (1999), Quantifying the Printability of SMT Adhesives, Heraeus, Web site: http://www.4hcd.com/techpprs/gluprint/glupri.html