Process and pad design optimization for 01005 passive component surface mount assembly

Soldering and Surface Mount Technology

Volumn 19, Issue 1, 2007, Pages 34-44

  Yu, Wang ^a   Olorunyomi, Michael ^a   Dahlberg, Martin ^b   Djurovic, Zoran ^b   Anderson, Johan ^c   Johan, Liu ^c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b Mydata Automation AB   (Sweden)

^c NONE

Author keywords

Electrical components; Printed circuits; Size reduction

Indexed keywords

ELECTRONICS PACKAGING; LOGIC DESIGN; PORTABLE EQUIPMENT; PRINTED CIRCUITS;

ELECTRICAL COMPONENTS; ELECTRONICS PACKAGING DENSITY; SIZE REDUCTION;

OPTIMIZATION;

EID: 34147217603     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910710748212     Document Type: Article

References (7)

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2. Barrentine, L.B. (1999), An Introduction to Design of Experiments: A Simplified Approach, ASQ Quality Press, Milwaukee, WI.
3. Djurovic, Z., Dahlberg, M. and Anderson, J. (2004), "Experimental study of component placement in solder paste", Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, pp. 185-94.
4. IPC (1995), J-STD-005. Requirements for Soldering Pastes, IPC, Northbrook, IL.
5. IPC (2000), IPC-A-610C. Acceptability for Electronic Assemblies, IPC, Northbrook, IL.
6. Kress, E. (1985), "Solder pad geometry studies for surface mount of chip capacitors", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 8 No. 4, pp. 505-11.
7. Mattsson, F., Geiger, D., Shangguan, D. and Castello, T. (2005), "Design and assembly of 01005 size passives using Pb-free solder", Circuits Assembly, Vol. 16 No. 5, pp. 22-7.