Influence of self-assembled organic thin film monolayer on ambient copper surfaces oxidation

Materials Research Society Symposium Proceedings

Volumn 1029, Issue , 2008, Pages 33-38

  Platzman, Ilia ^a   Haick, Hossam ^a   Tannenbaum, Rina ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR CONDITIONS; COPPER OXIDE LAYERS; COPPER SURFACE; CU FILMS; CU OXIDE; CU SURFACES; DIISOCYANIDE; GROWTH MECHANISMS; ORGANIC THIN FILMS; OXIDE THICKNESS; POLYCRYSTALLINE COPPER; QUANTITATIVE STUDY; SELF-ASSEMBLED; TEM; UNSTABLE BEHAVIOR;

CHEMISORPTION; COPPER OXIDES; ELECTRON ENERGY LEVELS; FILM PREPARATION; FILM THICKNESS; MOLECULAR ELECTRONICS; MOLECULAR SPECTROSCOPY; MONOLAYERS; OXIDATION; OXIDE FILMS; PROTECTIVE COATINGS; SURFACES; THERMAL EVAPORATION; THIN FILM DEVICES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 67649383626     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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