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Volumn 377-379, Issue , 1997, Pages 931-936
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Electrochemical Cu deposition on thiol covered Au(111) surfaces
a a a
a
EPFL
(Switzerland)
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Author keywords
Copper; Electrochemical methods; Gold; Growth; Scanning tunneling microscopy; Self assembly; Thiols
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Indexed keywords
CHEMISORPTION;
COMPOSITION EFFECTS;
CRYSTAL STRUCTURE;
CYCLIC VOLTAMMETRY;
ELECTROCHEMICAL ELECTRODES;
ELECTRODEPOSITION;
FILM GROWTH;
GOLD;
MONOLAYERS;
PARTICLES (PARTICULATE MATTER);
QUASICRYSTALS;
SCANNING TUNNELING MICROSCOPY;
ELECTROCHEMICAL CURRENTS;
THIOLS;
COPPER;
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EID: 0031124101
PISSN: 00396028
EISSN: None
Source Type: Journal
DOI: 10.1016/S0039-6028(96)01524-5 Document Type: Article |
Times cited : (35)
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References (24)
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