Soft lithography contacts to organics

Materials Today

Volumn 8, Issue 7, 2005, Pages 42-54

  Hsu, Julia W P ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; ELECTRIC RESISTANCE; ELECTRODES; ENERGY DISSIPATION; EVAPORATION; INTERFACES (MATERIALS); LIGHT EMITTING DIODES; ORGANIC SUPERCONDUCTING MATERIALS; PHOTOLUMINESCENCE; PHOTONS; SUPERCONDUCTING DEVICES;

NANOTRANSFER PRINTING (NTP); ORGANIC LIGHT-EMITTING DIODES (OLED); ORGANIC MATERIALS; SOFT-CONTACT LAMINATION (SCL);

LITHOGRAPHY;

EID: 20444412644     PISSN: 13697021     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-7021(05)70986-X     Document Type: Article

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