Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 449-458

  Chuang, Cheng Li ^a   Aoh, Jong Ning ^b   Din, Rong Fong ^b  

^a CHUNG SHAN MEDICAL UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER OXIDES; DIFFUSION; GOLD COMPOUNDS; OXIDATION; WIRE;

ATOMIC INTER-DIFFUSION; BONDING STRENGTH; BONDING TEMPERATURE; COPPER PADS;

CHEMICAL BONDS;

EID: 30844467533     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.01.010     Document Type: Article

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