Mitigation of noise coupling in multilayer high-speed PCB: State of the art modeling methodology and EBG technology

IEICE Transactions on Communications

Volumn E93-B, Issue 7, 2010, Pages 1678-1689

  Wu, Tzong Lin ^a   Fan, Jun ^b   De Paulis, Francesco ^c   Wang, Chuen De ^a   Scogna, Antonio Ciccomancini ^d   Orlandi, Antonio ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b University of Missouri Rolla   (United States)

^c UNIVERSITY OF L'AQUILA   (Italy)

^d CST of America   (United States)

Author keywords

EBG; Ground bounce noise; GSPL; Multilayer high speed PCB modeling; PCPL; PDN

Indexed keywords

CRYSTAL STRUCTURE; EQUIVALENT CIRCUITS; MULTILAYERS;

ELECTROMAGNETIC BANDGAP STRUCTURES; EQUIVALENT CIRCUIT MODEL; GROUND BOUNCE NOISE; GSPL; HIGH SPEED; HIGH SPEED DIGITAL CIRCUIT; PCPL; POWER DISTRIBUTION NETWORK;

PRINTED CIRCUIT BOARDS;

EID: 77954342537     PISSN: 09168516     EISSN: 17451345     Source Type: Journal    
DOI: 10.1587/transcom.E93.B.1678     Document Type: Article

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