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Volumn 2, Issue , 2007, Pages 972-993

Developing a "physical" model for vias - Part II: Coupled and ground return vias

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT ELEMENTS; COMPLEX CONFIGURATION; GOOD CORRELATIONS; GROUND RETURN; HIGH FREQUENCY; PHYSICAL MODEL; PHYSICS-BASED; SIMPLE EQUIVALENT CIRCUIT MODEL; SINGLE-ENDED;

EID: 84866362819     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (55)

References (11)
  • 1
    • 84866404184 scopus 로고    scopus 로고
    • Developing a physical model for vias
    • Santa Clara, CA, USA, February 6-9
    • C. Schuster, Y. Kwark, G. Selli, P. Muthana, "Developing a Physical Model for Vias", IEC DesignCon, Santa Clara, CA, USA, February 6-9, 2006.
    • (2006) IEC DesignCon
    • Schuster, C.1    Kwark, Y.2    Selli, G.3    Muthana, P.4
  • 2
    • 34047223544 scopus 로고    scopus 로고
    • Model-to-hardware correlation of physics based via models with the parallel plate impedance included
    • Portland, OR, USA, August
    • G. Selli, C. Schuster, Y. Kwark, J. Drewniak, "Model-to-Hardware Correlation of Physics Based Via Models With the Parallel Plate Impedance Included", IEEE Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 2006.
    • (2006) IEEE Symposium on Electromagnetic Compatibility
    • Selli, G.1    Schuster, C.2    Kwark, Y.3    Drewniak, J.4
  • 4
    • 0035475862 scopus 로고    scopus 로고
    • Physics-based CAD models for the analysis of vias in parallel-plate environments
    • October
    • R. Abhari, G. V. Eleftheriades, E. van Deventer-Perkins, "Physics-Based CAD Models for the Analysis of Vias in Parallel-Plate Environments", IEEE Transactions on MTT, vol. 49, no. 10, pp. 1697-1707, October 2001.
    • (2001) IEEE Transactions on MTT , vol.49 , Issue.10 , pp. 1697-1707
    • Abhari, R.1    Eleftheriades, G.V.2    Van Deventer-Perkins, E.3
  • 5
    • 0033360282 scopus 로고    scopus 로고
    • Modeling of interconnections and isolation within a multilayered ball grid array package
    • September
    • R. Ito, R. W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Transactions on MTT, vol. 47, no. 9, pp. 1819-1825, September 1999.
    • (1999) IEEE Transactions on MTT , vol.47 , Issue.9 , pp. 1819-1825
    • Ito, R.1    Jackson, R.W.2    Hongsmatip, T.3
  • 6
    • 34047239114 scopus 로고    scopus 로고
    • The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
    • Santa Clara, CA
    • Y. Kwark, C. Schuster, L. Shan, C. Baks, J. Trewhella, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", IEC DesignCon Conference, Santa Clara, CA, 2005.
    • (2005) IEC DesignCon Conference
    • Kwark, Y.1    Schuster, C.2    Shan, L.3    Baks, C.4    Trewhella, J.5
  • 8
    • 0015331132 scopus 로고
    • The planar circuit - An approach to microwave integrated circuitry
    • April
    • T. Okoshi and T. Miyodhi, "The planar circuit - an approach to microwave integrated circuitry," IEEE Transaction on Microwave Theory and Technique, Vol. 20, No. 4, April 1972, pp. 245 - 252.
    • (1972) IEEE Transaction on Microwave Theory and Technique , vol.20 , Issue.4 , pp. 245-252
    • Okoshi, T.1    Miyodhi, T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.