-
1
-
-
84866404184
-
Developing a physical model for vias
-
Santa Clara, CA, USA, February 6-9
-
C. Schuster, Y. Kwark, G. Selli, P. Muthana, "Developing a Physical Model for Vias", IEC DesignCon, Santa Clara, CA, USA, February 6-9, 2006.
-
(2006)
IEC DesignCon
-
-
Schuster, C.1
Kwark, Y.2
Selli, G.3
Muthana, P.4
-
2
-
-
34047223544
-
Model-to-hardware correlation of physics based via models with the parallel plate impedance included
-
Portland, OR, USA, August
-
G. Selli, C. Schuster, Y. Kwark, J. Drewniak, "Model-to-Hardware Correlation of Physics Based Via Models With the Parallel Plate Impedance Included", IEEE Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 2006.
-
(2006)
IEEE Symposium on Electromagnetic Compatibility
-
-
Selli, G.1
Schuster, C.2
Kwark, Y.3
Drewniak, J.4
-
3
-
-
84876586562
-
Accuracy and application of physics based circuit model for vias
-
San Diego, CA, USA, October
-
th International Symposium on Microelectronics, San Diego, CA, USA, October 2006.
-
(2006)
th International Symposium on Microelectronics
-
-
Schuster, C.1
Kwark, Y.H.2
Ritter, M.B.3
Selli, G.4
Drewniak, J.L.5
-
4
-
-
0035475862
-
Physics-based CAD models for the analysis of vias in parallel-plate environments
-
October
-
R. Abhari, G. V. Eleftheriades, E. van Deventer-Perkins, "Physics-Based CAD Models for the Analysis of Vias in Parallel-Plate Environments", IEEE Transactions on MTT, vol. 49, no. 10, pp. 1697-1707, October 2001.
-
(2001)
IEEE Transactions on MTT
, vol.49
, Issue.10
, pp. 1697-1707
-
-
Abhari, R.1
Eleftheriades, G.V.2
Van Deventer-Perkins, E.3
-
5
-
-
0033360282
-
Modeling of interconnections and isolation within a multilayered ball grid array package
-
September
-
R. Ito, R. W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Transactions on MTT, vol. 47, no. 9, pp. 1819-1825, September 1999.
-
(1999)
IEEE Transactions on MTT
, vol.47
, Issue.9
, pp. 1819-1825
-
-
Ito, R.1
Jackson, R.W.2
Hongsmatip, T.3
-
6
-
-
34047239114
-
The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
-
Santa Clara, CA
-
Y. Kwark, C. Schuster, L. Shan, C. Baks, J. Trewhella, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", IEC DesignCon Conference, Santa Clara, CA, 2005.
-
(2005)
IEC DesignCon Conference
-
-
Kwark, Y.1
Schuster, C.2
Shan, L.3
Baks, C.4
Trewhella, J.5
-
7
-
-
0018442043
-
Theory and experiment in microstrip antennas
-
March
-
Y.T. Lo, W. Solomon, and W.F. Richards, "Theory and Experiment in microstrip antennas," IEEE Transactions on Antenna and Propagation, vol. AP-7, no.2, 37-145, March 1979.
-
(1979)
IEEE Transactions on Antenna and Propagation
, vol.AP-7
, Issue.2
, pp. 37-145
-
-
Lo, Y.T.1
Solomon, W.2
Richards, W.F.3
-
8
-
-
0015331132
-
The planar circuit - An approach to microwave integrated circuitry
-
April
-
T. Okoshi and T. Miyodhi, "The planar circuit - an approach to microwave integrated circuitry," IEEE Transaction on Microwave Theory and Technique, Vol. 20, No. 4, April 1972, pp. 245 - 252.
-
(1972)
IEEE Transaction on Microwave Theory and Technique
, vol.20
, Issue.4
, pp. 245-252
-
-
Okoshi, T.1
Miyodhi, T.2
-
9
-
-
0029288362
-
Wave model to the ground/power plane noise problem
-
April
-
G.T. Lei, R.W. Techentin, R.P. Hayes, D.J. Schwab, and B.K. Gilbert," Wave model to the Ground/Power Plane Noise Problem," IEEE Transactions on Instrumentations and Measurements, Vol.44, No.2, April 1995, pp. 300-303.
-
(1995)
IEEE Transactions on Instrumentations and Measurements
, vol.44
, Issue.2
, pp. 300-303
-
-
Lei, G.T.1
Techentin, R.W.2
Hayes, R.P.3
Schwab, D.J.4
Gilbert, B.K.5
-
10
-
-
0032649064
-
High-frequency characterization of power/ground-planes structures
-
May
-
G.T. Lei, R.W. Techentin, and B.K. Gilbert, "High-frequency characterization of power/ground-planes structures" IEEE Transactions on microwave Theory and Technique, Vol.47, No.5, May 1999, pp. 562-569.
-
(1999)
IEEE Transactions on Microwave Theory and Technique
, vol.47
, Issue.5
, pp. 562-569
-
-
Lei, G.T.1
Techentin, R.W.2
Gilbert, B.K.3
-
11
-
-
0034239323
-
Modeling and transient simulation of planes in electronic packages
-
Aug.
-
N. Na, J. Choi, S. Chun, M. Swaminatham, and J. Srinivasan, "Modeling and transient Simulation of planes in electronic packages," IEEE Transaction on Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 340-352.
-
(2000)
IEEE Transaction on Advanced Packaging
, vol.23
, Issue.3
, pp. 340-352
-
-
Na, N.1
Choi, J.2
Chun, S.3
Swaminatham, M.4
Srinivasan, J.5
|