SCOPUS 정보 검색 플랫폼

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 317-320

Impedance design for multi-layered vias

(3) Gu, Xiaoxiong a Ruehli, Albert E a Ritter, Mark B a

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES; MATHEMATICAL MODELS;

CHARACTERISTIC IMPEDANCES; DESIGN PARAMETERS; GEOMETRICAL PARAMETERS; LINEAR MODELS; SCATTERING MODELS; STATISTICAL VARIATIONS; THROUGH HOLES; TOLERANCE SPECIFICATIONS;

ELECTRONICS PACKAGING;

EID: 58049129986 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPEP.2008.4675944 Document Type: Conference Paper

Times cited : (13)

References (8)

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2
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- Johnson, H.¹ Graham, M.²

3
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- Y. Jong, W. Guo, G. Shiuc, C. Lin, and R. Wu. Reflccitionlcss design for differcntial-via transitions using neural network-based approach. In Digest of Electr. Perf. Electronic Packaging, pages 143-146, Atlanta, GA, October 2007.
- (2007) Digest of Electr. Perf. Electronic Packaging , pp. 143-146
- Jong, Y.¹ Guo, W.² Shiuc, G.³ Lin, C.⁴ Wu, R.⁵

4
- 33846021318
- Application of the Foldy-Lax multiple scattering method to the analysis of vias in ball grid arrays and incrior layer of printed circuit boards
- January
- C. Ong, D. Miller, L. Tsang, B. Wu, and C. Huang. Application of the Foldy-Lax multiple scattering method to the analysis of vias in ball grid arrays and incrior layer of printed circuit boards. Microwave and Optical Technology Letters, pages 225-231, January 2007.
- (2007) Microwave and Optical Technology Letters , pp. 225-231
- Ong, C.¹ Miller, D.² Tsang, L.³ Wu, B.⁴ Huang, C.⁵

5
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- S-pararneter-based IC interonnect transmission line characterization
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- Eisenstadt, W.¹ Eo, Y.²

6
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- Statistical signal integrity analysis and diagnosis methodology for high-speed systems
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7
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- Application of Foldy-Lax multiple scattering method to via analysis in multilayer printed circuit board
- Santa Clara, CA, February
- X. Gu and M. Ritter. Application of Foldy-Lax multiple scattering method to via analysis in multilayer printed circuit board. In Proc. of DesignCon Conference, Santa Clara, CA, February 2008.
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8
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