Equivalent circuit models for evaluation of bandgap limits for planar electromagnetic bandgap structures

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2010, Pages 770-775

  De Paulis, Francesco ^a   Raimondo, Leo ^a   Orlandi, Antonio ^a   Ren, Liehui ^b   Fan, Jun ^b  

^a UNIVERSITY OF L'AQUILA   (Italy)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BAND GAPS; EBG STRUCTURE; ELECTROMAGNETIC BANDGAP STRUCTURES; EQUIVALENT CIRCUIT MODEL; LUMPED-ELEMENT CIRCUITS; THREE DIMENSIONAL SIMULATIONS; UPPER LIMITS;

ELECTROMAGNETIC COMPATIBILITY; ENERGY GAP; EQUIVALENT CIRCUITS; THREE DIMENSIONAL COMPUTER GRAPHICS;

ELECTROMAGNETISM;

EID: 79952422889     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2010.5711376     Document Type: Conference Paper

References (12)

1. T.L. Wu, C. Wang, Y. Lin, T. Wang, G. Chang, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits, " IEEE Microw. Wireless Compon. Lett., vol.15, no. 3, pp. 174-176, Mar. 2005.
2. M.Swaminathan, A.Ege Engin Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, New York, USA, 2008.
3. C.H. Tsai, T.L. Wu, "A GHz Common-mode Filter Using Negative Permittivity Metamaterial on Low Temperature Co-fire Ceramic (LTCC) Substrate", in Proc. Of 2009 IEEE Symposium on Electromagnetic Compatibility, Austin, TX, USA, August 17-21, 2009.
4. F. de Paulis, A. Orlandi, L. Raimondo, B. Archambeault , S. Connor, "Common Mode Filtering Performances of Planar EBG Structures", in Proc. of 2009 IEEE Symposium on Electromagnetic Compatibility, Austin, TX, USA, August 17-21, 2009.
5. F. de Paulis, L. Raimondo, S. Connor, B. Archambeault, A. Orlandi, "Design of a Common Mode Filter by using Planar Electromagnetic Bandgap Structures", submitted for publication in IEEE Transactions on Advanced Packaging, 2009.
6. F. de Paulis, L. Raimondo, A. Orlandi, "IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications" accepted for publication to IEEE Trans. on Advanced Packaging, 2009.
7. T.L. Wu, C. Wang, Y. Lin, T. Wang, G. Chang, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits, " IEEE Microw. Wireless Compon. Lett., vol.15, no. 3, pp. 174-176, Mar. 2005.
8. K. H. Kim, J. E. Schutt-Ainé, "Analysis and Modeling of Hybrid Planar-Type Electromagnetic-Bandgap Structures and Feasibility Study on Power Distribution Network Applications", IEEE Transaction on Microwave Theory and Techniques, vol. 56, no. 1, January 2008.
9. Computer Simulation Techgnology, CST Studio Suite 2009, www.cst.com.
10. F. de Paulis, A. Orlandi, L. Raimondo, G.Antonini, "Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I - Microstrip lines", in Proc. of EMC Europe Workshop 2009, Athens, Greece, June 11-12, 2009.
11. Agilent Technologies, Advanced Design System, www.home.agilent.com.
12. Zhong, C. Koh, "Exact Closed Form Formula for Partial Mutual Inductances of On-Chip Interconnects", in Proc. of the 2002 IEEE International Conference on Computer Design: VLSI in Computers and Processors (ICCD'02), Freiburg, Germany, September 16-18, 2002.