Model-to-hardware correlation of physics based via models with the parallel plate impedance included

IEEE International Symposium on Electromagnetic Compatibility

Volumn 3, Issue , 2006, Pages 781-785

  Selli, Giuseppe ^a   Schuster, Christian ^b   Kwark, Young ^b  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Model to hardware correlation; Parallel plate impedance; Physics based via models; Recessed probe launch

Indexed keywords

COMPUTER SIMULATION; ELECTRIC IMPEDANCE; MATHEMATICAL MODELS;

PARALLEL PLATE IMPEDANCE; RECESSED PROBE LAUNCH;

PRINTED CIRCUIT BOARDS;

EID: 34047223544     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706416     Document Type: Conference Paper

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