-
1
-
-
0029409390
-
"Modeling and analysis of multichip module power supply planes"
-
Nov
-
K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 18, pp. 628-639, Nov. 1995.
-
(1995)
IEEE Trans. Compon., Packag., Manuf. Technol. B
, vol.18
, pp. 628-639
-
-
Lee, K.1
Barber, A.2
-
2
-
-
15044345136
-
"A study on modeling and frequency characteristics of power-distribution planes in multilayer printed circuit boards responsible for radiated emission"
-
Ph.D. dissertation, Univ. Electro-Commun., Tokyo, Japan, Mar
-
T. Harada, "A study on modeling and frequency characteristics of power-distribution planes in multilayer printed circuit boards responsible for radiated emission," Ph.D. dissertation, Univ. Electro-Commun., Tokyo, Japan, Mar. 2000.
-
(2000)
-
-
Harada, T.1
-
3
-
-
15044360068
-
"Electrical package modeling including voltage and ground reference planes using the partial element equivalent circuit (PEEC) method"
-
Zurich, Switzerland, Feb. Paper 45H4
-
B. Archambeault and A. Ruehli, "Electrical package modeling including voltage and ground reference planes using the partial element equivalent circuit (PEEC) method," in Proc. 13th Int. Zurich Symp. Electromagn. Compat., Zurich, Switzerland, Feb. 1999, Paper 45H4.
-
(1999)
Proc. 13th Int. Zurich Symp. Electromagn. Compat.
-
-
Archambeault, B.1
Ruehli, A.2
-
4
-
-
0035519365
-
"DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction"
-
Nov
-
J. Fan, J. L. Drewmiak, H. Shi, and J. L. Knighten, "DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction," IEEE Trans. Electromagn. Compat., vol. 43, pp. 426-436, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, pp. 426-436
-
-
Fan, J.1
Drewmiak, J.L.2
Shi, H.3
Knighten, J.L.4
-
5
-
-
0035519737
-
"DC power-bus design using FDTD modeling with dispersive media and surface mount technology components"
-
Nov
-
X. Ye, M. Y. Koledintseva, M. Li, and J. L. Drewniak, "DC power-bus design using FDTD modeling with dispersive media and surface mount technology components," IEEE Trans. Electromagn. Compat., vol. 43, pp. 579-587, Nov. 2001.
-
(2001)
IEEE Trans. Electromagn. Compat.
, vol.43
, pp. 579-587
-
-
Ye, X.1
Koledintseva, M.Y.2
Li, M.3
Drewniak, J.L.4
-
6
-
-
0029288362
-
"Wave model solution to the ground/power plane noise problem"
-
Apr
-
C.-T. Lei, R. W. Techentin, P. R. Hayees, D. J. Schwab, and B. K. Gilbert, "Wave model solution to the ground/power plane noise problem," IEEE Trans. Instrum. Meas., vol. 44, pp. 300-303, Apr. 1995.
-
(1995)
IEEE Trans. Instrum. Meas.
, vol.44
, pp. 300-303
-
-
Lei, C.-T.1
Techentin, R.W.2
Hayees, P.R.3
Schwab, D.J.4
Gilbert, B.K.5
-
7
-
-
0032649064
-
"High-frequency characterization of power/ground-plane structures"
-
May
-
C.-T. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory Tech., vol. 47, pp. 562-569, May 1999.
-
(1999)
IEEE Trans. Microw. Theory Tech.
, vol.47
, pp. 562-569
-
-
Lei, C.-T.1
Techentin, R.W.2
Gilbert, B.K.3
-
10
-
-
0033681359
-
"Development of a closed-form expression for the input impedance of power-ground plane structures"
-
Washington, DC, Aug
-
M. Xu, Y. Ji, T. H. Hubing, T. Van Doren, and J. Drewniak, "Development of a closed-form expression for the input impedance of power-ground plane structures," in Proc. IEEE Int. Symp. Electromagn. Compat., Washington, DC, Aug. 2000, pp. 77-82.
-
(2000)
Proc. IEEE Int. Symp. Electromagn. Compat.
, pp. 77-82
-
-
Xu, M.1
Ji, Y.2
Hubing, T.H.3
Van Doren, T.4
Drewniak, J.5
-
11
-
-
0022734457
-
"Faster computation of Z-matrices for rectangular segments in planar microstrip circuits"
-
Jun
-
A. Benalla and K. C. Gupta, "Faster computation of Z-matrices for rectangular segments in planar microstrip circuits," IEEE Trans. Microw. Theory Tech., vol. MTT-34, pp. 733-736, Jun. 1986.
-
(1986)
IEEE Trans. Microw. Theory Tech.
, vol.MTT-34
, pp. 733-736
-
-
Benalla, A.1
Gupta, K.C.2
-
12
-
-
0003300114
-
"An improved closed-form expression for accurate and rapid calculation of power/ground plane impedance of multilayer PCBs"
-
Toyama, Japan, Oct. Paper EMT-00-68
-
Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "An improved closed-form expression for accurate and rapid calculation of power /ground plane impedance of multilayer PCBs," in Proc. Symp. Electromagn. Theory Toyama, Japan, Oct. 2000, Paper EMT-00-68.
-
(2000)
Proc. Symp. Electromagn. Theory
-
-
Wang, Z.L.1
Wada, O.2
Toyota, Y.3
Koga, R.4
-
13
-
-
2442538016
-
"Reduction of Q-factors of resonances in power/ground planes of multilayer PCBs by using resistive metal films"
-
Oct
-
Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Reduction of Q-factors of resonances in power/ground planes of multilayer PCBs by using resistive metal films," Trans. IEE Japan, vol. 121-A, no. 10, pp. 928-932, Oct. 2001.
-
(2001)
Trans. IEE Japan
, vol.121 A
, Issue.10
, pp. 928-932
-
-
Wang, Z.L.1
Wada, O.2
Toyota, Y.3
Koga, R.4
-
16
-
-
0141932911
-
"Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs"
-
Beijing, China, May
-
Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs," in Proc. 3rd Int. Symp. Electromagn. Compat., Beijing, China, May 2002, pp. 775-778.
-
(2002)
Proc. 3rd Int. Symp. Electromagn. Compat.
, pp. 775-778
-
-
Wang, Z.L.1
Wada, O.2
Toyota, Y.3
Koga, R.4
-
17
-
-
0141940116
-
"Modeling of gapped power bus structures for isolation using cavity modes"
-
Boston, MA, Aug
-
Z. L. Wang, O. Wada, and R. Koga, "Modeling of gapped power bus structures for isolation using cavity modes," in Proc. IEEE Symp. Electromagn. Compat., Boston, MA, Aug. 2003, pp. 10-15.
-
(2003)
Proc. IEEE Symp. Electromagn. Compat.
, pp. 10-15
-
-
Wang, Z.L.1
Wada, O.2
Koga, R.3
-
18
-
-
84954187239
-
"Analysis of resonance characteristics of a power bus with rectangle and triangle elements in multilayer PCBs"
-
Hangzhou, China, Nov
-
Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Analysis of resonance characteristics of a power bus with rectangle and triangle elements in multilayer PCBs," in Proc. 3rd Asia-Pacific Conf. Environ. Electromagn., Hangzhou, China, Nov. 2003, pp. 73-76.
-
(2003)
Proc. 3rd Asia-Pacific Conf. Environ. Electromagn.
, pp. 73-76
-
-
Wang, Z.L.1
Wada, O.2
Toyota, Y.3
Koga, R.4
-
19
-
-
15044358413
-
"Using cavity-modes for modeling of via-connected power bus stacks in multilayer PCBs"
-
presented at the Int. Symp. Electromagn. Compat., Sendai, Japan, Jun
-
Z. L. Wang, O. Wada, T. Yaguchi, T. Miyashita, Y. Toyota, and R. Koga, "Using cavity-modes for modeling of via-connected power bus stacks in multilayer PCBs," presented at the Int. Symp. Electromagn. Compat., Sendai, Japan, Jun. 2004.
-
(2004)
-
-
Wang, Z.L.1
Wada, O.2
Yaguchi, T.3
Miyashita, T.4
Toyota, Y.5
Koga, R.6
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