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Volumn 2, Issue , 2006, Pages 1281-1304

Developing a "physical" model for vias

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX ENVIRONMENTS; HIGH-SPEED COMMUNICATION SYSTEMS; IMPACT SYSTEM; PHYSICS-BASED; POWER INTEGRITY;

EID: 84866404184     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (91)

References (30)
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    • Modeling of interconnections and isolation within a multilayered ball grid array package
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    • R. Ito, R. W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 47, no. 9, pp. 1819-1825, September 1999.
    • (1999) IEEE Transactions on Microwave Theory and Techniques , vol.47 , Issue.9 , pp. 1819-1825
    • Ito, R.1    Jackson, R.W.2    Hongsmatip, T.3
  • 13
    • 0026188029 scopus 로고
    • Capacitance of a circular symmetric model of a via hole including finite ground plane thickness
    • July
    • P. Kok, D. De Zutter, "Capacitance of a Circular Symmetric Model of a Via Hole Including Finite Ground Plane Thickness", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 39, no. 7, pp. 1229-1234, July 1991.
    • (1991) IEEE Transactions on Microwave Theory and Techniques , vol.39 , Issue.7 , pp. 1229-1234
    • Kok, P.1    De Zutter, D.2
  • 14
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    • Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCB
    • May
    • T. Kushta, K. Narita, T. Kaneko, T. Saeki, H. Tohya "Resonance Stub Effect in a Transition From a Through Via Hole to a Stripline in Multilayer PCB", IEEE WIRELESS COMPONENTS LETTERS, vol. 13, no. 5, pp. 169-171, May 2003.
    • (2003) IEEE Wireless Components Letters , vol.13 , Issue.5 , pp. 169-171
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  • 15
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    • The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
    • Santa Clara, CA
    • Y. Kwark, C. Schuster, L. Shan, C. Baks, J. Trewhella, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", IEC DesignCon Conference, Santa Clara, CA, 2005.
    • (2005) IEC DesignCon Conference
    • Kwark, Y.1    Schuster, C.2    Shan, L.3    Baks, C.4    Trewhella, J.5
  • 19
    • 0026407952 scopus 로고
    • Full wave analysis of propagation characteristics of through hole using the finite-difference time-domain method
    • December
    • S. Maeda, T. Kashiwa, I. Fukai, "Full Wave Analysis of Propagation Characteristics of Through Hole Using the Finite-Difference Time-Domain Method", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 39, no. 12, pp. 2154-2159, December 1991.
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    • Maeda, S.1    Kashiwa, T.2    Fukai, I.3
  • 22
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    • Equivalent circuit models for three-dimensional multiconductor systems
    • March
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    • (1974) IEEE Transactions on Microwave Theory and Techniques , vol.22 , Issue.3 , pp. 216-221
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  • 23
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  • 30
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    • Seattle, WA
    • J. Zhao, J. Fang, "Validity of Mutual Inductor Model for Electromagnetic Coupling Between Vias in Integrated-Circuit Packages and Printed Circuit Boards", Electronic Components & Technology Conference (ECTC), Seattle, WA, 1998.
    • (1998) Electronic Components & Technology Conference (ECTC)
    • Zhao, J.1    Fang, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.