-
1
-
-
0035475862
-
Physics-based CAD models for the analysis of vias in parallel-plate environments
-
October
-
R. Abhari, G. V. Eleftheriades, E. van Deventer-Perkins, "Physics-Based CAD Models for the Analysis of Vias in Parallel-Plate Environments", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 49, no. 10, pp. 1697-1707, October 2001.
-
(2001)
IEEE Transactions on Microwave Theory and Techniques
, vol.49
, Issue.10
, pp. 1697-1707
-
-
Abhari, R.1
Eleftheriades, G.V.2
Van Deventer-Perkins, E.3
-
2
-
-
0028484288
-
FDTD modeling of noise in computer packages
-
August
-
W. D. Becker, R. Mittra, "FDTD Modeling of Noise in Computer Packages", IEEE Transactions on COMPONENTS, PACKAGING AND MANUFACTURING -PART B, vol. 17, no. 3, pp. 240-247, August 1994.
-
(1994)
IEEE Transactions on Components, Packaging and Manufacturing -part B
, vol.17
, Issue.3
, pp. 240-247
-
-
Becker, W.D.1
Mittra, R.2
-
3
-
-
0025390066
-
Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems
-
March
-
A. C Cangellaris, J. L. Prince, L. P. Vakanas, "Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems", IEEE Transactions on COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, vol. 13, no. 1, pp. 154-159, March 1990.
-
(1990)
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol.13
, Issue.1
, pp. 154-159
-
-
Cangellaris, A.C.1
Prince, J.L.2
Vakanas, L.P.3
-
4
-
-
84945248252
-
Efficient modeling of simultaneous switching noise in a realistic computer system
-
Princeton, NJ
-
S. Chun, A. Haridass, C O'Reilly, "Efficient Modeling of Simultaneous Switching Noise in a Realistic Computer System", IEEE Topical Meeting on Electronic Performance of Electronic Packaging (EPEP), Princeton, NJ, 2003.
-
(2003)
IEEE Topical Meeting on Electronic Performance of Electronic Packaging (EPEP)
-
-
Chun, S.1
Haridass, A.2
O'Reilly, C.3
-
5
-
-
34047213675
-
Developing a working model for vias
-
Santa Clara, CA
-
G. Edlund, Y. Kwark, C Schuster. L. Shan, "Developing a Working Model for Vias", IEC DesignCon Conference, Santa Clara, CA, 2004.
-
(2004)
IEC DesignCon Conference
-
-
Edlund, G.1
Kwark, Y.2
Schuster, C.3
Shan, L.4
-
6
-
-
84866352303
-
Modeling of power/ground plane noise in high speed digital electronics packaging
-
Monterey, CA
-
J. Fang, Y. Liu, Y. Chen, Z. Wu, A. Agrawal, "Modeling of Power/Ground Plane Noise in High Speed Digital Electronics Packaging", IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, 1993.
-
(1993)
IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP)
-
-
Fang, J.1
Liu, Y.2
Chen, Y.3
Wu, Z.4
Agrawal, A.5
-
7
-
-
0028732117
-
Model of interaction between signal vias and metal planes in electronics packaging
-
Monterey, CA
-
J. Fang, Y. Chen, Z. Wu, D. Xue, "Model of Interaction Between Signal Vias and Metal Planes in Electronics Packaging", IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, 1994.
-
(1994)
IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP)
-
-
Fang, J.1
Chen, Y.2
Wu, Z.3
Xue, D.4
-
8
-
-
0027543288
-
Modeling of vias in multilayered integrated circuits
-
February
-
Q. Gu, E. Yang, M. A. Tassoudji, "Modeling of Vias in Multilayered Integrated Circuits", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 41, no. 2, pp. 206-214, February 1993.
-
(1993)
IEEE Transactions on Microwave Theory and Techniques
, vol.41
, Issue.2
, pp. 206-214
-
-
Gu, Q.1
Yang, E.2
Tassoudji, M.A.3
-
9
-
-
0028743752
-
Coupled noise analysis for adjacent vias in multilayered digital circuits
-
December
-
Q. Gu, M. A. Tassoudji, S. Y. Poh, R. T. Shin, J. A. Kong, "Coupled Noise Analysis for Adjacent Vias in Multilayered Digital Circuits", IEEE Transactions on CIRCUITS AND SYSTEMS -PART I, vol. 41, no. 12, pp. 796-804, December 1994.
-
(1994)
IEEE Transactions on Circuits and Systems -part i
, vol.41
, Issue.12
, pp. 796-804
-
-
Gu, Q.1
Tassoudji, M.A.2
Poh, S.Y.3
Shin, R.T.4
Kong, J.A.5
-
10
-
-
0033360282
-
Modeling of interconnections and isolation within a multilayered ball grid array package
-
September
-
R. Ito, R. W. Jackson, T. Hongsmatip, "Modeling of Interconnections and Isolation Within a Multilayered Ball Grid Array Package", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 47, no. 9, pp. 1819-1825, September 1999.
-
(1999)
IEEE Transactions on Microwave Theory and Techniques
, vol.47
, Issue.9
, pp. 1819-1825
-
-
Ito, R.1
Jackson, R.W.2
Hongsmatip, T.3
-
12
-
-
1242284893
-
-
chapter 5.5, Prentice Hall, NJ
-
H. Johnson, M. Graham, "High-Speed Signal Propagation: Advanced Black Magic", chapter 5.5, Prentice Hall, NJ, 2003.
-
(2003)
High-Speed Signal Propagation: Advanced Black Magic
-
-
Johnson, H.1
Graham, M.2
-
13
-
-
0026188029
-
Capacitance of a circular symmetric model of a via hole including finite ground plane thickness
-
July
-
P. Kok, D. De Zutter, "Capacitance of a Circular Symmetric Model of a Via Hole Including Finite Ground Plane Thickness", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 39, no. 7, pp. 1229-1234, July 1991.
-
(1991)
IEEE Transactions on Microwave Theory and Techniques
, vol.39
, Issue.7
, pp. 1229-1234
-
-
Kok, P.1
De Zutter, D.2
-
14
-
-
0037596796
-
Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCB
-
May
-
T. Kushta, K. Narita, T. Kaneko, T. Saeki, H. Tohya "Resonance Stub Effect in a Transition From a Through Via Hole to a Stripline in Multilayer PCB", IEEE WIRELESS COMPONENTS LETTERS, vol. 13, no. 5, pp. 169-171, May 2003.
-
(2003)
IEEE Wireless Components Letters
, vol.13
, Issue.5
, pp. 169-171
-
-
Kushta, T.1
Narita, K.2
Kaneko, T.3
Saeki, T.4
Tohya, H.5
-
15
-
-
34047239114
-
The recessed probe launch - A new signal launch for high frequency characterization of board level packaging
-
Santa Clara, CA
-
Y. Kwark, C. Schuster, L. Shan, C. Baks, J. Trewhella, "The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging", IEC DesignCon Conference, Santa Clara, CA, 2005.
-
(2005)
IEC DesignCon Conference
-
-
Kwark, Y.1
Schuster, C.2
Shan, L.3
Baks, C.4
Trewhella, J.5
-
16
-
-
0035421185
-
Modeling differential via holes
-
E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion, "Modeling Differential Via Holes", IEEE Transactions on ADVANCED PACKAGING, vol. 24, no. 3, pp. 357-363
-
IEEE Transactions on Advanced Packaging
, vol.24
, Issue.3
, pp. 357-363
-
-
Laermans, E.1
De Geest, J.2
De Zutter, D.3
Olyslager, F.4
Sercu, S.5
Morlion, D.6
-
17
-
-
0036589403
-
Modeling complex via hole structures
-
May
-
E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion, "Modeling Complex Via Hole Structures", IEEE Transactions on ADVANCED PACKAGING, vol. 25, no. 2, pp. 206-214, May 2002.
-
(2002)
IEEE Transactions on Advanced Packaging
, vol.25
, Issue.2
, pp. 206-214
-
-
Laermans, E.1
De Geest, J.2
De Zutter, D.3
Olyslager, F.4
Sercu, S.5
Morlion, D.6
-
19
-
-
0026407952
-
Full wave analysis of propagation characteristics of through hole using the finite-difference time-domain method
-
December
-
S. Maeda, T. Kashiwa, I. Fukai, "Full Wave Analysis of Propagation Characteristics of Through Hole Using the Finite-Difference Time-Domain Method", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 39, no. 12, pp. 2154-2159, December 1991.
-
(1991)
IEEE Transactions on Microwave Theory and Techniques
, vol.39
, Issue.12
, pp. 2154-2159
-
-
Maeda, S.1
Kashiwa, T.2
Fukai, I.3
-
21
-
-
0023849002
-
Characterization of via connections in silicon circuit boards
-
January
-
J. P. Quine, H. F. Webster, H. H. Glascock, R. O. Carlson, "Characterization of Via Connections in Silicon Circuit Boards", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 36, no. 1, pp. 21-27, January 1988.
-
(1988)
IEEE Transactions on Microwave Theory and Techniques
, vol.36
, Issue.1
, pp. 21-27
-
-
Quine, J.P.1
Webster, H.F.2
Glascock, H.H.3
Carlson, R.O.4
-
22
-
-
0016035432
-
Equivalent circuit models for three-dimensional multiconductor systems
-
March
-
A. E. Ruehli, "Equivalent Circuit Models for Three-Dimensional Multiconductor Systems", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 22, no. 3, pp. 216-221, March 1974.
-
(1974)
IEEE Transactions on Microwave Theory and Techniques
, vol.22
, Issue.3
, pp. 216-221
-
-
Ruehli, A.E.1
-
23
-
-
0035519414
-
Parasitic modes on printed circuit boards and their effects on EMC and signal integrity
-
November
-
C. Schuster, W. Fichtner, "Parasitic Modes on Printed Circuit Boards and Their Effects on EMC and Signal Integrity", IEEE Transactions on ELECTROMAGNETIC COMPATIBILITY, vol. 43, no. 4, pp. 416-425, November 2001.
-
(2001)
IEEE Transactions on Electromagnetic Compatibility
, vol.43
, Issue.4
, pp. 416-425
-
-
Schuster, C.1
Fichtner, W.2
-
24
-
-
54249161421
-
Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique
-
December
-
R. Sorrentino, F. Alessandri, M. Mongiardo, G. Avitabile, L. Roselli, "Full-Wave Modeling of Via Hole Grounds in Microstrip by Three-Dimensional Mode Matching Technique", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 40, no. 12, pp. 2228-2234, December 1992.
-
(1992)
IEEE Transactions on Microwave Theory and Techniques
, vol.40
, Issue.12
, pp. 2228-2234
-
-
Sorrentino, R.1
Alessandri, F.2
Mongiardo, M.3
Avitabile, G.4
Roselli, L.5
-
26
-
-
0024029374
-
Quasi-static analysis of a microstrip via through a hole in a ground plane
-
June
-
T. Wang, R. F. Harrington, J. R. Mautz, "Quasi-Static Analysis of a Microstrip Via Through a Hole in a Ground Plane", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 36, no. 6, pp. 1008-1013, June 1988.
-
(1988)
IEEE Transactions on Microwave Theory and Techniques
, vol.36
, Issue.6
, pp. 1008-1013
-
-
Wang, T.1
Harrington, R.F.2
Mautz, J.R.3
-
27
-
-
84866369928
-
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
-
submitted to
-
C. Wang, J. Mao, G. Selli, S. Luan, L. Zhang, J. Fan, D. J. Pommerenke, R. E. DuBroff, J. L. Drewniak, "An Efficient Approach for Power Delivery Network Design with Closed-Form Expressions for Parasitic Interconnect Inductances", submitted to IEEE Transactions on ADVANCED PACKAGING, 2005.
-
(2005)
IEEE Transactions on Advanced Packaging
-
-
Wang, C.1
Mao, J.2
Selli, G.3
Luan, S.4
Zhang, L.5
Fan, J.6
Pommerenke, D.J.7
Dubroff, R.E.8
Drewniak, J.L.9
-
28
-
-
0028495838
-
Characterization of high frequency interconnects using the finite difference time domain and finite element methods
-
September
-
J. Yook, N. I. Dibb, L. P. B. Katehi, "Characterization of High Frequency Interconnects Using the Finite Difference Time Domain and Finite Element Methods", IEEE Transactions on MICROWAVE THEORY AND TECHNIQUES, vol. 42, no. 9, pp. 1727-1735, September 1994.
-
(1994)
IEEE Transactions on Microwave Theory and Techniques
, vol.42
, Issue.9
, pp. 1727-1735
-
-
Yook, J.1
Dibb, N.I.2
Katehi, L.P.B.3
-
30
-
-
0031625148
-
Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards
-
Seattle, WA
-
J. Zhao, J. Fang, "Validity of Mutual Inductor Model for Electromagnetic Coupling Between Vias in Integrated-Circuit Packages and Printed Circuit Boards", Electronic Components & Technology Conference (ECTC), Seattle, WA, 1998.
-
(1998)
Electronic Components & Technology Conference (ECTC)
-
-
Zhao, J.1
Fang, J.2
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