Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 4, 2003, Pages 375-384

  Tsang, Leung ^a,b   Miller, Dennis ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b University of Washington   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Differential signaling; Package resonance; Printed circuit board; Shorting vias; Signal integrity; Vias

Indexed keywords

CAVITY RESONATORS; GREEN'S FUNCTION; MAGNETIC FIELDS; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE;

CIRCULAR CAVITY; CYLINDRICAL WAVES; ELECTROMAGNETIC ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0742321350     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.821081     Document Type: Article

References (14)

1. L. Tsang, H. Chen, C.-C. Huang, and V. Jandhyala, "Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax Equations," Microwave Optical Technol. Lett., vol. 31, pp. 201-208, Nov. 2001.
2. H. Chen, Q. Li, L. Tsang, C.-C. Huang, and V. Jandhyala, "Analysis of large number of vias and Differential Signaling in multilayered structures," IEEE Trans. Microwave Theory Tech., vol. 51, pp. 818-829, Mar. 2003.
3. C.-C. Huang, L. Tsang, and C.H. Chan, "Multiple scattering among vias in lossy planar waveguides using SMCG method," IEEE Trans. Adv. Packag., vol. 25, pp. 181-188, May 2002.
4. T. Wang, R. F. Harrington, and J. R. Mautz, "Quasistatic analysis of a microstrip via through a hole in a ground plane," IEEE Trans. Microwave Theory Tech., vol. 36, pp. 1008-1013, June 1988.
5. A. W. Mathis, A. F. Peterson, and C. M. Butler, "Rigorous and simplified models for the capacitance of a circularly symmetric via," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1875-1878, Oct. 1997.
6. S. G. Hsu and R. B. Wu, "Full wave characterization of a through hole via using the matrix-penciled moment method," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1540-1547, Aug. 1994.
7. ____, "Full-wave characterization of a through hole via in multilayered packaging," IEEE Trans. Microwave Theory Tech., vol. 43, pp. 1073-1081, May 1995.
8. Q. Gu, Y. E. Yang, and M. A. Tassoudji, "Modeling and analysis of vias in multilayered integrated circuits," IEEE Trans. Microwave Theory Tech., vol. 41, pp. 206-214, Feb. 1993.
9. Q. Gu, A. Tissoudji, S. Y. Poh, R. T. Shin, and J. A. Kong, "Coupled noise analysis for adjacent vias in multilayered digital circuits," IEEE Trans. Circuits Syst., vol. 41, pp. 796-804, Dec. 1994.
10. D. V. Otto, "The admittance of cylindrical antennas driven from a coaxial line," Radio Sci., vol. 2, no. 9, pp. 1031-1042, 1967.
11. L. Tsang, J. A. Kong, and K. H. Ding, Scattering of Electromagnetic Waves: Vol. 1 Theory and Applications. New York: Wiley, 2000.
12. L. Tsang, J. A. Kong, K. H. Ding, and C. Ao, Scattering of Electromagnetic Waves: Vol. 2 Numerical Simulations. New York: Wiley, 2001.
13. E. Laermans, J. D. Geest, D. D. Zutter, F. Olyslager, S. Sercu, and D. Morlion, "Modeling differential via holes," IEEE Trans. Adv. Packag., vol. 24, pp. 357-363, Aug. 2001.
14. J. Fang, J. Zhao, and J. Zhang, "Shorting via arrays for the elimination of package resonance to reduce power supply noise in multilayered area-array IC packages," in Proc. IEEE Symp. IC/Packag. Design Integr., Feb. 1998, pp. 116-119.