IR-DROP analysis and thermal assessment of planar electromagnetic bandgap structures for power integrity applications

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 3, 2010, Pages 617-622

  De Paulis, Francesco ^a   Raimondo, Leo ^a   Orlandi, Antonio ^a  

^a UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

Electromagnetic bandagap; IR DROP; power integrity (PI); thermal analysis

Indexed keywords

3D SIMULATIONS; ELECTROMAGNETIC BANDGAP STRUCTURES; ELECTROMAGNETIC PROPERTIES; HIGH FREQUENCY HF; HIGH FREQUENCY PERFORMANCE; IR-DROP; POWER INTEGRITY; TEMPERATURE VARIATION; THERMAL ANALYSIS; THERMAL ASSESSMENT; THERMAL PERFORMANCE;

DC POWER TRANSMISSION; DROPS; ELECTROMAGNETISM; ENERGY GAP; METAMATERIALS; THERMOANALYSIS; THREE DIMENSIONAL COMPUTER GRAPHICS;

MAGNETIC MATERIALS;

EID: 77954659574     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2033572     Document Type: Article

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