Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes

IEEE Transactions on Electromagnetic Compatibility

Volumn 49, Issue 2, 2007, Pages 441-447

  Engin, A Ege ^a   Bharath, Krishna ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Finite difference method (FDM); Helmholtz equation; Power ground planes; Simultaneous switching noise

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; HELMHOLTZ EQUATION; MATHEMATICAL MODELS; SWITCHING THEORY;

FULL-WAVE SIMULATORS; MULTILAYERED FINITE-DIFFERENCE METHOD (MFDM); PRINTED CIRCUIT BOARD PLANES; SIMULTANEOUS SWITCHING NOISE;

PRINTED CIRCUIT BOARDS;

EID: 34347396973     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2007.893331     Document Type: Article

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