Power plane SPICE models and simulated performance for materials and geometries

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 277-287

  Smith, Larry D ^a,b   Anderson, Raymond ^a,b   Roy, Tanmoy ^a,b  

^a IEEE   (United States)

^b SUN MICROSYSTEMS   (United States)

Author keywords

Capacitance; Damping; Dielectric thickness; Granularity; Impedance; Inductance; Power plane; Resonance; Skim effect; Spice model; Spreading inductance; Unit cells; Velocity

Indexed keywords

POWER PLANE; SPICE MODELS; SPREADING INDUCTANCE;

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; FREQUENCY DOMAIN ANALYSIS; INDUCTANCE; SKIN EFFECT; TIME DOMAIN ANALYSIS; TRANSMISSION LINE THEORY;

ELECTRONICS PACKAGING;

EID: 0035421276     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938294     Document Type: Article

References (16)

1. Power distribution system design methodology and capacitor selection for modern CMOS technology
2. Contribution of resonance to ground bounce in lossy thin film planes
3. Modeling and transient simulations of planes in electronic packages
4. Controlling power-distribution-plane resonance in multilayer printed circuit boards
5. Modeling and analysis of multichip module power supply planes
6. Accurate power supply and ground plane pair models
7. Power plane SPICE models for frequency and time domains
8. Decoupling capacitor calculations for CMOS circuits
9. Measuring milliohms and picohenrys in power distribution networks
10. Low impedance power planes with self damping
11. Lossy power distribution networks with thin dielectric layers and/or thin conductive layers
12. Chip-package resonance in core power supply structures for a high power microprocessor
13. ESR and ESL of ceramic capacitor applied to decoupling applications
14. Power bus decoupling on multilayer printed circuit boards