A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: Modeling and application in RF-SiP

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 3, 2010, Pages 582-591

  Hsieh, Chia Yuan ^a   Wang, Chuen De ^a   Lin, Kun You ^a   Wu, Tzong Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Electromagnetic bandgap (EBG); ground bounce noise (GBN); high speed digital circuits; mixed signal system; simultaneous switching noise (SSN)

Indexed keywords

ELECTROMAGNETIC BAND GAPS; GROUND BOUNCE NOISE; HIGH SPEED DIGITAL CIRCUIT; MIXED-SIGNAL SYSTEMS; SIMULTANEOUS SWITCHING NOISE;

DIGITAL INTEGRATED CIRCUITS; ELECTRIC SIGNAL SYSTEMS; ELECTROMAGNETISM; ENERGY GAP; FUZZY CONTROL; INTERNET PROTOCOLS; JITTER; MAGNETIC MATERIALS; METAMATERIALS; PACKAGING; SWITCHING;

COMPUTER SIMULATION;

EID: 77955516299     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2036858     Document Type: Article

References (15)

1. M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, "Power distribution networks for system-on-package: Status and challenges," IEEE Trans. Adv. Packag., vol.27, no.2, pp. 286-300, May 2004.
2. K. L. Tai, "System-in-package (SiP): Challenges and opportunities," in Proc. Asia-South Pacific Design Automat. Conf., 2000, pp. 211-216.
3. S.Van den Berghe, F. Olyslager, D.De Zutter, J. DeMoerloose, and W. Temmerman, "Study of the ground bounce caused by power plane resonances," IEEE Trans. Electromag. Compat., vol.40, no.2, pp. 111-119, May 1998.
4. T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, "Electromagnetic interference (EMI) of system-on-package (SOP)," IEEE Trans. Adv. Packag., vol.27, no.2, pp. 304-314, May 2004.
5. R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microwave Theory Tech., vol.51, no.6, pp. 1629-1639, Jun. 2003.
6. T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol.53, no.9, pp. 2935-2942, Sep. 2005.
7. T. L.Wu, Y. H. Lin, and S. T. Chen, "A novel power plane with superwideband elimination of ground bounce noise on high speed circuits," IEEE Microw. Wireless Compon. Lett., vol.15, no.3, pp. 174-176, Mar. 2005.
8. J. Lee, H. Kim, and J. Kim, "High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions," IEEE Microwave Wireless Componen. Lett., vol.15, no.8, pp. 505-507, Aug. 2005.
9. T. K. Wang, T. W. Han, and T. L. Wu, "A novel EBG power plane with stopband enhancement using artificial substrate," IEEE Trans. Microwave Theory Tech., vol.56, no.5, pp. 1164-1171, Sep. 2008.
10. K. H. Kim and J. E. Schutt-Aine, "Analysis and modeling of hybrid planar-type electromagnetic-bandgap structures and feasibility study on power distribution network applications," IEEE Trans. Microwave Theory Tech., vol.56, no.1, pp. 178-186, Jan. 2008.
11. T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microwave Wireless Compon. Lett., vol.13, no.1, pp. 21-23, Jan. 2003.
12. J. Qin and O. M. Ramahi, "Ultra-wideband mitigation of simultaneous switching noise using novel planar electromagnetic bandgap structures," IEEE Microw. Wireless Compon. Lett., vol.16, no.9, pp. 487-489, Sep. 2006.
13. C. Y. Hsieh, H. H. Chuang, T. K. Wang, C. C. Wang, H. H. Cheng, Y. S. Wu, C. T. Chiu, C. P. Hung, and T. L. Wu, "A novel stopbandenhanced EBG planes using an embedded slow-wave structure in lowcost RF-SiP," in IEEE 17th Topical Meeting Elect. Perform. Electron. Packag., Oct. 2008, pp. 131-134.
14. M. S. Zhang, Y. S. Li, C. Jia, and L. P. Li, "A power plane with wideband SSN suppression using a multi-via electromagnetic bandgap structure," IEEE Microwave Compon. Lett., vol.17, no.4, pp. 307-309, Apr. 2007.
15. J. Kim and M. Swaminathan, "Modeling of multilayered power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., vol.25, no.2, pp. 189-199, May 2002.