Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 441-447

  Guo, Chunlei ^a,b   Hubing, Todd H ^a,c  

^a University of Missouri Rolla   (United States)

^b Zeland Software Inc   (United States)

^c Clemson University   (United States)

Author keywords

Finite element method (FEM); Modeling; SPICE

Indexed keywords

CONDUCTIVE MATERIALS; DIELECTRIC LOSSES; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

FINITE RESISTANCE; MATRIX EQUATIONS; POWER BUS STRUCTURES;

PRINTED CIRCUIT BOARDS;

EID: 33747625200     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875089     Document Type: Article

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