EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

IEEE Transactions on Electromagnetic Compatibility

Volumn 43, Issue 4, 2001, Pages 538-548

  Ye, Xiaoning ^a   Hockanson, David M ^c   Li, Min ^a,d   Ren, Yong ^a,e   Cui, Wei ^a,b   Drewniak, James L ^a   DuBroff, Richard E ^a  

^a Architectural and Environmental Engineering   (United States)

^b INTEL CORPORATION   (United States)

^c SUN MICROSYSTEMS   (United States)

^d NOKIA RESEARCH CENTER   (United States)

^e Cadence Design System   (United States)

Author keywords

DC power bus; EMI mitigation; Finite difference time domain; Fringing electric fields; Via stitching

Indexed keywords

ELECTRIC FIELD EFFECTS; FINITE DIFFERENCE METHOD; MULTICHIP MODULES; MULTILAYERS; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS;

POWER-BUS STACKS;

ELECTROMAGNETIC WAVE INTERFERENCE;

EID: 0035519098     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/15.974633     Document Type: Article

References (26)

1. System design for EMC
2. Radiation from microstrip transmission lines
3. Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables
4. FDTD and experimental investigation of EMI from stacked-card PCB configurations
5. Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations
6. Accurate characterization of some radiative EMC phenomena at chip level, using dedicated EMC-test chips
7. Application of the FD-TD method to modeling the electromagnetic radiation from heatsinks
8. An investigation of PCB radiated emissions from simultaneous switching noise
9. FDTD analysis of electromagnetic radiation from modules-on-back-plane configuration
10. EMI associated with inter-board connection for module-on-back-plane and stacked-card configurations
11. Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination
12. Impact on radiated emissions of printed circuit board stitching
13. Crosstalk control for microstrip circuits on PCBs at microwave frequencies
14. Use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages
15. Characterization of plated via hole fences for isolation between stripline circuits in LTCC Packages
16. Numerical solution of initial boundary value problems involving Maxwell equations in isotropic media
17. Electromagnetic theory
18. The thin wire
19. FDTD modeling of digital signal propagation in 3-D circuits with passive and active loads
20. Perfectly matched layer for the absorption of electromagnetic waves
21. EMI from cavity modes of shielding enclosures - FDTD modeling and measurements
22. Design of air flow aperture arrays in shielding enclosures
23. High-frequency characterization of power/ground-plane structures
24. Using the matrix pencil method to estimate the parameters of a sum of complex exponentials