Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz

IEEE Transactions on Microwave Theory and Techniques

Volumn 57, Issue 8, 2009, Pages 2072-2083

  Rimolo Donadio, Renato ^a   Gu, Xiaoxiong ^b   Kwark, Young H ^b   Ritter, Mark B ^b   Archambeault, Bruce ^c   De Paulis, Francesco ^d   Zhang, Yaojiang ^e   Fan, Jun ^f   Brüns, Heinz Dietrich ^a   Schuster, Christian ^a  

^a HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM   (United States)

^d UNIVERSITY OF L'AQUILA   (Italy)

^e INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^f MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Modal decomposition; Package; Power distribution network (PDN); Printed circuit board (PCB); Via models

Indexed keywords

MULTILAYERS; PACKAGING; TRACE ELEMENTS;

ANALYTICAL FORMULATION; CAPACITIVE ELEMENTS; FULL-WAVE SIMULATIONS; MODAL DECOMPOSITION; MULTILAYER STRUCTURES; POWER DISTRIBUTION NETWORK; PRINTED CIRCUIT BOARD LEVEL; PRINTED CIRCUIT BOARDS (PCB);

PRINTED CIRCUIT BOARDS;

EID: 77958096098     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2009.2025470     Document Type: Conference Paper

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