Modeling of striplines between a power and a ground plane

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 415-426

  Engin, A Ege ^a,b   John, Werner ^a   Sommer, Grit ^a,d   Mathis, Wolfgang ^c   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Mode conversion; Nonideal power ground planes; Return path discontinuity; Stripline

Indexed keywords

COMPUTER SIMULATION; ELECTRIC LINES; MATHEMATICAL MODELS;

GROUND PLANES; MODE CONVERSION; MULTICONDUCTOR TRANSMISSION LINE; NONIDEAL POWER; RETURN PATH DISCONTINUITY; TRANSVERSE ELECTROMAGNETIC (TEM) PARALLEL-PLATE MODE;

STRIP TELECOMMUNICATION LINES;

EID: 33747607969     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.872998     Document Type: Article

References (18)

1. X. Wang, S. Kabir, J. Weber, S. Dvorak, and J. Prince, "A study of the fields associated with horizontal dipole sources in stripline circuits," IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 280-287, May 2002.
2. M. Burchett, S. Pennock, and P. Shepherd, "A rigorous analysis of uniform stripline of arbitrary dimensions," IEEE Trans. Microw. Theory Tech., vol. 41, no. 12, pp. 2074-2080, Dec. 1993.
3. R. Abhari, G. V. Eleftheriades, and E. van Deventer-Perkins, "Physics-based CAD models for the analysis of vias in parallel-plate environments," IEEE Trans. Microw. Theory Tech., vol. 49, no. 10, pp. 1697-1707, Oct. 2001.
4. H. Liaw and H. Merkelo, "Simulation and modeling of mode conversion at vias in multilayer interconnections," in Proc. Electron. Compon. Technol. Conf., 1995, pp. 361-367.
5. J. Fang, Y. Chen, Z. Wu, and D. Xue, "Model of interaction between signal vias and metal planes in electronics packaging," Proc. Elec. Performance Electron. Packag., pp. 211-214, 1994.
6. S. Chun, M. Swaminathan, L. Smith, J. Srinivasan, J. Zhang, and M. Iyer, "Modeling of simultaneous switching noise in high speed systems," IEEE Trans. Adv. Packag., vol. 24, no. 2, pp. 132-142, May 2001.
7. S. Chun, L. Smith, R. Anderson, and M. Swaminathan, "Model to hardware correlation for power distribution induced I/O noise in a functioning computer system," in Proc. Electron. Compon. Technol. Conf., May 2002, pp. 319-324.
8. N. Orhanovic, D. Divekar, and N. Matsui, "Structure decomposition for hybrid analysis of multilayer interconnect systems," in Proc. Elec. Performance Electron. Packag., Oct. 2002, pp. 137-140.
9. S. Grivet-Talocia, H.-M. Huang, A. Ruehli, F. Canavero, and I. Elfadel, "Transient analysis of lossy transmission lines: An efficient approach based on the method of characteristics," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 45-56, Feb. 2004.
10. N. Nakhla, A. Dounavis, R. Achar, and M. Nakhla, "DEPACT: Delay extraction-based passive compact transmission-line macromodeling algorithm," IEEE Trans. Adv. Packag., vol. 28, no. 1, pp. 13-23, Feb. 2005.
11. K. M. Coperich Branch, J. Morsey, A. C. Cangellaris, and A. Ruehli, "Physically consistent transmission line models for high-speed interconnects in lossy dielectrics," IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 129-135, May 2002.
12. A. E. Engin, W. John, G. Sommer, and W. Mathis, "Modeling of non-ideal planes in stripline structures," in Proc. Elec. Performance Electron. Packag., Princeton, NJ, Oct. 2003, pp. 247-250.
13. A. E. Engin, W. John, G. Sommer, and W. Mathis, "Three-conductor modeling of striplines at via discontinuities," in Proc. EMC Sendai, Sendai, Japan, Jun. 2004, pp. 61-64.
14. C. R. Paul, Analysis of Multiconductor Transmission Lines, New York: Wiley, 1994, pp. 65-68.
15. L. Smith, "Simultaneous switch noise and power plane bounce for CMOS technology," in Proc. Elec. Performance Electron. Packag., Oct. 1999, pp. 163-165.
16. A. E. Engin, W. Mathis, W. John, and G. Sommer, "Lumped skin-effect model for interconnects," in Int. Symp. Signals, Syst., Electron., Linz, Austria, Aug. 2004.
17. J.-H. Kim and M. Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., vol. 24, no. 3, pp. 334-346, Aug. 2001.
18. A. E. Engin, W. Mathis, W. John, G. Sommer, and H. Reichl, "Time-domain modeling of lossy substrates with constant loss tangent," in Proc. IEEE Workshop Signal Propagation on Interconnects, Heidelberg, Germany, May 2004, pp. 151-154.