Predicting noise voltage from trace crossing split planes on printed circuit Boards

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2009, Pages 45-50

  Pan, Weifeng ^a   Connor, Samuel ^b   Archambeault, Bruce ^b  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST CONSTRAINTS; HIGH-SPEED DATA; NOISE VOLTAGE; REFERENCE PLANE; SPACE LIMITATIONS; SPLIT PLANE; STITCHING CAPACITOR;

ELECTROMAGNETIC COMPATIBILITY; PLASTIC MOLDS; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 74349130225     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2009.5284660     Document Type: Conference Paper

References (11)

1. W. Cui, J. Fan, H. Shi, and J. L. Drewniak, "DC power bus noise isolation with power islands," in Proc. IEEE Int. Symp. Electromagn. Compat., 2001, pp. 899-903.
2. Proper design of intentional splits in the ground reference plane of PC boards to minimize emissions on I/O wires and cables Archambeault, B.; Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on Volume 2, 24-28 Aug. 1998 Page(s):768 - 773 vol.2
3. Crossing the planes at high speed. Signal integrity issues at split ground and power planes; Liaw, H.-J.; Merkelo, H.; Circuits and Devices Magazine, IEEE Volume 13, Issue 6, Nov. 1997 Page(s):22 - 26
4. Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards Jingook Kim; Heeseok Lee; Joungho Kim; Advanced Packaging, IEEE Transactions on Volume 28, Issue 4, Nov. 2005 Page(s):724 - 735
5. Composite effects of reflections and ground bounce for signal line through a split power plane Chun-Te Wu; Guang-Hwa Shiue; Sheng-Mou Lin; Ruey-Beei Wu; Advanced Packaging, IEEE Transactions on Volume 25, Issue 2, May 2002 Page(s):297 - 301
6. Electrical impact of high-speed bus crossing plane split Juan Chen; Weimin Shi; Norman, A.J.; Ilavarasan, P.; Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on Volume 2, 19-23 Aug. 2002 Page(s):861 - 865 vol.2
7. Effect of stitching capacitor distance for critical traces crossing split reference planes Roden, J.A.; Archambeault, B.; Lyle, R.D.; Electromagnetic Compatibility, 2003 IEEE International Symposium on Volume 2, 18-22 Aug. 2003 Page(s):703 - 707 vol.2
8. Slot Transmission Line Model of Interconnections Crossing Split Power/Ground Plane on High-speed Multi-layer Board Kim, J.; Kim, H.; Youchul Jeong; Lee, J.; Signal Propagation on Interconnects, 6th IEEE Workshop on. Proceedings 12-15 May 2002 Page(s):23 - 26
9. Routing differential I/O signals across split ground planes at the connector for EMI control Gisin, F.; Pantic-Tanner, Z.; Electromagnetic Compatibility, 2000. IEEE International Symposium on Volume 1, 21-25 Aug. 2000 Page(s):325 - 327 vol.1
10. EZ-FDTD Users Manual. www.ems-plus.com
11. IEEE EMC Society Newsletter, Winter 2006 issue, pp 56-67. www.emsc.org