Perturbation based modeling strategy for weakly coupled interconnects

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Volumn , Issue , 2009, Pages 215-218

  Shi, Hao ^a  

^a APPLE INC   (United States)

Author keywords

Coupled interconnect; Crosstalk; Perturbation

Indexed keywords

COUPLED INTERCONNECTS; COUPLING EFFECT; INTERCONNECT CROSSTALK; INTERCONNECT STRUCTURES; MODELING STRATEGY; NOISE PREDICTIONS; PCB DESIGN; REAL-WORLD; SUB-SYSTEMS;

ELECTRONICS PACKAGING; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS;

CROSSTALK;

EID: 74549217272     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2009.5338438     Document Type: Conference Paper

References (5)

1. Xiaoxiong Gu, and et al, "Fully Analytical Methodology for Fast End-to-End Link Analysis on Complex Printed Circuit Boards including Signal and Power Integrity Effects," DesignCon 2009 13-TA2, Feb. 2009, Santa Clara, CA.
2. Sigrity Corp, "PowerSI User's Guide,"2009.
3. Amy Luoh, Gene Garrison, and Jon Powell, "Switching Voltage Regulator Noise Coupling Analysis for Printed Circuit Board Systems," DesignCon 2009 10-TH, Feb. 2009, Santa Clara, CA.
4. Agilent Technologies, "Advanced Design System Documentation, "2009.
5. Ansoft (Ansys Inc), "High Frequency Structure Simulator V11 User's Guide,"2009.