Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 9, 2008, Pages 2118-2128

  Zhang, Yaojiang ^a,b   Fan, Jun ^a,b   Selli, Giuseppe ^a,c   Cocchini, Matteo ^b   De Paulis, Francesco ^b  

^a IEEE

^b Architectural and Environmental Engineering   (United States)

^c Amkor   (United States)

Author keywords

Analytical formula; Green's function in a coaxial cavity; Multilayer package printed circuit board (PCB); Signal integrity; Via holes; Via plate capacitance

Indexed keywords

BOOLEAN FUNCTIONS; CAPACITANCE; COMPUTER NETWORKS; DIFFERENTIAL EQUATIONS; ELECTRIC CONDUCTORS; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; GREEN'S FUNCTION; MAGNETIC MATERIALS; MULTILAYERS; NETWORKS (CIRCUITS); NUMERICAL METHODS; PLATING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; REAL TIME SYSTEMS; REFLECTION; WALLS (STRUCTURAL PARTITIONS);

ANALYTICAL FORMULA; GREEN'S FUNCTION IN A COAXIAL CAVITY; MULTILAYER PACKAGE/PRINTED CIRCUIT BOARD (PCB); SIGNAL INTEGRITY; VIA-HOLES; VIA-PLATE CAPACITANCE;

PLATE METAL;

EID: 51649126662     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.2002237     Document Type: Article

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