Phase transformation and morphology of the intermetallic compounds formed at the Sn-9Zn-3.5Ag/Cu interface in aging

Journal of Alloys and Compounds

Volumn 458, Issue 1-2, 2008, Pages 189-199

  Hon, Min Hsiung ^a   Chang, Tao Chih ^a,b   Wang, Moo Chin ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c KAOHSIUNG MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Hexagonal; Intermetallic compound; Kirkendall voids; Monoclinic; Phase transformation; Sn 9Zn 3.5Ag Cu

Indexed keywords

DECOMPOSITION; PHASE TRANSITIONS; SOLID STATE REACTIONS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

KIRKENDALL VOIDS; MONOCLINIC;

INTERMETALLICS;

EID: 43049116911     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.04.004     Document Type: Article

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