Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate

Journal of Materials Science: Materials in Electronics

Volumn 11, Issue 6, 2000, Pages 461-471

  Yu, Shan Pu ^a   Lin, Hsiu Ju ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; EUTECTICS; FLUXES; HEAT TREATMENT; INTERMETALLICS; SUBSTRATES; THERMAL EFFECTS; TIN ALLOYS;

EUTECTIC SOLDERS;

SOLDERING ALLOYS;

EID: 0034240575     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008960316695     Document Type: Article

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