SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1133-1137

Interfacial reactions in the Sn-Ag/Au couples

(2) Chen, S W a Yen, Y W a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Interfacial reactions; Lead free solder; Sn Ag Cu couples

Indexed keywords

ACTIVATION ENERGY; DIFFUSION; GOLD ALLOYS; GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; SILVER ALLOYS; SUBSTRATES; THERMAL EFFECTS; TIN ALLOYS;

ARRHENIUS EQUATION; LEAD FREE SOLDER; PARABOLIC LAW; REACTION COUPLE TECHNIQUE; TEMPERATURE DEPENDENCE;

SOLDERING ALLOYS;

EID: 0035454949 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-001-0140-x Document Type: Article

Times cited : (47)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.