Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 8, 2005, Pages 523-528

  Kim, Dae Gon ^a   Jang, Hyung Sun ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CHEMICAL ANALYSIS; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; GROWTH (MATERIALS); HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); REACTION KINETICS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

AGING TEMPERATURE; BARE COPPER SUBSTRATE; SOLID STATE INTERMETALLIC COMPOUND LAYER; SOLID-STATE ISOTHERMAL AGING;

INTERMETALLICS;

EID: 24944481521     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10854-005-2727-0     Document Type: Article

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