Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface

Journal of Alloys and Compounds

Volumn 381, Issue 1-2, 2004, Pages 162-167

  Wang, Moo Chin ^a,b   Yu, Shan Pu ^c   Chang, Tao Chih ^c   Hon, Min Hsiung ^c  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b NATIONAL UNITED UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

91Sn 8.55Zn 0.45Al lead free solder alloy; Intermetallic compound; Kinetic; Planar; Scallop shaped; Cu5Zn8

Indexed keywords

ACTIVATION ENERGY; DIFFUSION; EUTECTICS; INTERMETALLICS; REACTION KINETICS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

91SN-8.55ZN-0.45AL LEAD FREE SOLDER ALLOY; COPPER INTERFACE; PLANAR; SCALLOP-SHAPED;

SOLDERING ALLOYS;

EID: 4944246800     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.03.095     Document Type: Article

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