Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface

Journal of Alloys and Compounds

Volumn 389, Issue 1-2, 2005, Pages 133-139

  Wang, Moo Chin ^a,b   Yu, Shan Pu ^c   Chang, Tao Chih ^c   Hon, Min Hsiung ^c  

^a NATIONAL UNITED UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

91Sn 8.55Zn 0.45Al lead free solder alloy; Cu 6Sn5; Intermetallic compounds; Planar shaped; Scallop shaped; Cu5Zn8; Cu9Al4

Indexed keywords

COPPER; ELECTRON DIFFRACTION; EUTECTICS; FLUXES; INTERFACES (MATERIALS); LEAD; MORPHOLOGY; NITROGEN COMPOUNDS; OXIDATION; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

91SN-8.55FZN-0.45AL LEAD-FREE SOLDER ALLOY; CU6ZN8; PLANAR-SHAPED; SCALLOP-SHAPED; Γ-CU5ZN8; Γ′-CU9AL4;

INTERMETALLICS;

EID: 13444269367     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.08.009     Document Type: Article

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