Evolution of intermetallic compounds layers in the soldered Sn-3.7Ag-1.0In-0.9Zn/Cu interface

Journal of Alloys and Compounds

Volumn 468, Issue 1-2, 2009, Pages 203-208

  Xu, R L ^a   Liu, Y C ^a   Wei, C ^a   Wang, X ^a   Gao, Z M ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Diffusion; Metallography; Metals and alloys

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; DENDRITES (METALLOGRAPHY); DIFFUSION; INTERMETALLICS; LEAD; LEAD COMPOUNDS; METALLIC COMPOUNDS; METALLOGRAPHY; METALLURGY; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; WELDING; ZINC;

ATOMIC DIFFUSIONS; CU SUBSTRATES; INTERFACIAL STRUCTURES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; METALS AND ALLOYS; SOLDER LAYERS;

TIN;

EID: 58049211694     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.01.060     Document Type: Article

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