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Journal of Alloys and Compounds

Volumn 464, Issue 1-2, 2008, Pages 301-305

Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling rates

(5) Wei, C a Liu, Y C a Han, Y J a Wan, J B a Yang, K a

a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS (China)

Author keywords

Intermetallic compounds (IMCs); Lead free solder; Microstructure; Sn Ag Zn

Indexed keywords

BRAZING; COOLING; EUTECTICS; MICROSTRUCTURE; SILVER; TIN ALLOYS; WELDING; ZINC;

COOLING RATES; INTERMETALLIC COMPOUNDS (IMCS); LEAD-FREE SOLDER; SN-AG-ZN;

TIN;

EID: 49749113756 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2007.09.103 Document Type: Article

Times cited : (41)

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