Interfaces in lead-free soldering

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1249-1256

  Hwang, Chi Won ^a   Kim, Keun Soo ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Interface; Intermetallic compound; Lead free solder; Reaction layer; Soldering

Indexed keywords

COPPER ALLOYS; INTERFACES (MATERIALS); INTERMETALLICS; NICKEL ALLOYS; PLATING; PRECIPITATION (CHEMICAL); SOLDERING ALLOYS; TERNARY SYSTEMS; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY;

LEAD FREE SOLDERING; REACTION LAYER; STRUCTURAL INTEGRITY;

SOLDERING;

EID: 0348107251     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0019-0     Document Type: Article

References (19)

1. K. Suganuma, Current Opinion Solid State Mater. Sci. 5, 555 (2001).
2. K.N. Tu and K. Zeng, Mater. Sci. Eng. R34, 1 (2001).
3. H.K. Kim, H.K. Liou, and K.N. Tu, Appl. Phys. Lett. 66, 2237 (1995).
4. T.B. Massalski, H. Okamoto, P.R. Subramanian, and L. Kacprzak, Binary Alloy Phase Diagrams, 2nd ed. (Materials Park, OH: ASM International, 1990), pp. 1481-1483.
5. N. Sarafianos, Mater. Sci. Technol. 3, 66 (1987).
6. W.K. Choi and H.M. Lee, J. Electron. Mater. 28, 1251 (1999).
7. K.S. Kim, S.H. Huh, and K. Suganuma, Mater. Sci. Eng. A333, 106 (2002).
8. D. Frear, D. Gravis, and J.W. Morris, J. Electron. Mater. 16, 181 (1987).
9. C.H. Ho, Y.M. Chen, and Y.M. Kao, J. Electron. Mater. 28, 1231 (1999).
10. G. Ghosh, J. Electron. Mater. 28, 1238 (1999).
11. C.W. Hwang, J.G. Lee, K. Suganuma, and H. Mori, J. Electron. Mater. 32, 52 (2003).
12. P. Liu, Z. Xu, and J.K. Shang, Metall. Mater. Trans. A 31A, 2857 (2000).
13. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).
14. Y. Kariya, Y. Hirat, and M. Otsuka, J. Electron. Mater. 28, 1263 (1999).
15. C.W. Hwang, K. Suganuma, J.G. Lee, and H. Mori, J. Mater. Res. 18, 1202 (2003).
16. S.W. Yoon, J.R. Soh, H.M. Lee, H.M. Kim, and B.J. Lee, Acta Mater. 45, 951 (1997).
17. S.P. Yu, M.H. Hon, and M.C. Wang, J. Electron. Mater. 29, 237 (2000).
18. K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998).
19. H.M. Lee, S.W. Yoon, and B.J. Lee, J. Electron. Mater. 27, 1161 (1998).