Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Journal of Materials Research

Volumn 21, Issue 10, 2006, Pages 2436-2439

  Yang, S C ^a   Ho, C E ^a   Chang, C W ^a   Kao, C R ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

PHASE DIAGRAM; REACTION SENSITIVITY; ZINC CONCENTRATION;

COPPER ALLOYS; INTERFACES (MATERIALS); PHASE DIAGRAMS; SUBSTRATES; TERNARY SYSTEMS; TIN ALLOYS; ZINC ALLOYS;

SOLDERING ALLOYS;

EID: 33749863019     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0320     Document Type: Article

References (17)

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