Copper interconnect technology for the 32 nm node and beyond

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2009, Pages 141-148

  Gambino, Jeff ^a   Chen, Fen ^a   He, John ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

32-NM NODE; COPPER INTERCONNECTS; CU-INTERCONNECTS; INTEGRATION OF PASSIVE DEVICES; MICROELECTRONICS INDUSTRY; MIXED SIGNAL; POROUS LOW-K MATERIAL;

MICROELECTRONICS; NANOTECHNOLOGY;

INTEGRATED CIRCUITS;

EID: 74049124940     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2009.5280904     Document Type: Conference Paper

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