Changing density requirements for semiconductor manufacturing

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 535-542

  Landis, Howard S ^a   Sucharitaves, Jeanne Tania ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUAL-DAMASCENE COPPER; DUMMY-SHAPES TREATMENTS; SEMICONDUCTOR INDUSTRY; SHALLOW TRENCH ISOLATION;

CHEMICAL MECHANICAL POLISHING; DEFECT STRUCTURES; DENSITY (SPECIFIC GRAVITY); DIELECTRIC DEVICES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 33947279453     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)