Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2000, Pages 153-156

  Zurcher, Peter ^a   Alluri, Prasad ^a   Chu, Peir ^a   Duvallet, Alain ^a   Happ, Chris ^a   Henderson, Rashaunda ^a   Mendonca, John ^a   Kim, Matthew ^a   Petras, Michael ^a   Raymond, Mark ^a   Remmel, Tom ^a   Roberts, Doug ^a   Steimle, Bob ^a   Stipanuk, Jim ^a   Straub, Sherry ^a   Sparks, Terry ^a   Tarabbia, Marc ^a   Thibieroz, Helene ^a   Miller, Me1 ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COPPER; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON NITRIDE; THIN FILMS;

THIN FILM RESISTORS (TFR);

MIM DEVICES;

EID: 0345815430     PISSN: 01631918     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEDM.2000.904281     Document Type: Article

References (3)