Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 108-110

  Landers, W ^a   Edelstein, D ^a   Clevenger, L ^a   Das, S ^a   Yang, C C ^a   Aoki, T ^a   Beaulieu, F ^a   Casey, J ^a   Cowley, A ^a   Cullinan, M ^a   Daubenspeck, T ^a   Davis, C ^a   Demarest, J ^a   Duchesne, E ^a   Guerin, L ^a   Hawken, D ^a   Ivers, T ^a   Lane, M ^a   Liu, X ^a   Lombardi, T ^a   McCarthy, C ^a   Muzzy, C ^a   Nadeau Filteau, J ^a   Questad, D ^a   Sauter, W ^a   Shaw, T ^a   Wright, J ^a   more..

^a IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TESTING; DEEP THERMAL CYCLE (DTC); LASER DICING; ORGANIC PACKAGES;

CHEMICAL VAPOR DEPOSITION; DELAMINATION; DIAMONDS; ORGANOMETALLICS; SEMICONDUCTING SILICON; SILICON WAFERS; THIN FILM CIRCUITS;

COPPER;

EID: 8644274781     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)