Effects of Al doping on the electromigration performance of damascene Cu interconnects

Journal of Applied Physics

Volumn 101, Issue 1, 2007, Pages

  Yokogawa, Shinji ^a   Tsuchiya, Hideaki ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ELECTROMIGRATION; GRAIN BOUNDARIES; OPTICAL INTERCONNECTS; THERMAL DIFFUSION; VELOCITY MEASUREMENT;

DAMASCENE CU INTERCONNECTS; DRIFT VELOCITY; ELECTRON MICROPROBE TECHNIQUE;

SEMICONDUCTOR DOPING;

EID: 33846301057     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2405739     Document Type: Article

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