A multilevel copper/low-k/airgap BEOL technology

Advanced Metallization Conference (AMC)

Volumn , Issue , 2008, Pages 329-336

  Nitta, S ^a   Ponoth, S ^a   Breyta, G ^a   Colburn, M ^a   Clevenger, L ^b   Horak, D ^a   Bhushan, M ^b   Casey, J ^b   Chan, E ^b   Cohen, S ^a   Colt, Jr ^b   Flaitz, P ^b   Fluhr, E ^b   Fuller, N ^a   Kniffin, A ^b   Huang, E ^a   Hu, C K ^a   Kumar, K ^b   Landis, H ^b   Li, B ^b   Li, W K ^b   Liniger, E ^a   Lisi, A ^b   Liu, X ^a   Lloyd, J R ^a   Melville, I ^b   Muncy, J ^b   Nogami, T ^a   Ramachandran, V ^b   Rath, D L ^a   Standaert, T ^b   Sucharitaves, J T ^b   Tumbull, D ^c   Crabbe, E ^b   McCredie, B ^b   Lane, M ^d   Purushothaman, S ^a   Edelstein, D ^a   more..

^a IBM RESEARCH   (United States)

^b IBM   (United States)

^c IBM CANADA LTD   (Canada)

^d EMORY AND HENRY COLLEGE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR GAPS; CAPACITANCE REDUCTIONS; MICRO-PROCESSORS; SELF-ASSEMBLY;

METALLIZING;

EID: 55349090279     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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