Electromigration of Cu/low dielectric constant interconnects

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 213-231

  Hu, C K ^a   Gignac, L ^a   Rosenberg, R ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; COPPER; FLOW PATTERNS; PERMITTIVITY; PHYSICAL VAPOR DEPOSITION; THIN LAYER CHROMATOGRAPHY;

CHIP DENSITY; INTERFACE DIFFUSIVITY; LOW DIELECTRIC CONSTANT;

ELECTROMIGRATION;

EID: 30844463697     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.015     Document Type: Article

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