Impact of size effects on the resistivity of copper wires and consequently the design and performance of metal interconnect networks

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 197-199

  Sarvari, Reza ^a   Naeemi, Azad ^a   Venkatesan, Raguraman ^a   Meindl, James D ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP PERFORMANCE; COPPER WIRES; METAL INTERCONNECT NETWORKS; SIZE EFFECTS;

COPPER; GRAIN BOUNDARIES; METALLIZING; NANOTECHNOLOGY; SURFACE PHENOMENA; WIRE;

INTERCONNECTION NETWORKS;

EID: 28244437189     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. C. Durkan and M.E. Welland, Physical Rev. B, Vol. 61, 14215 (2000).
3. W. Steinhgöl, et al., Physical Rev. B, Vol. 66, 075414 (2002).
4. R. Venkatesan et al., IEEE Trans. VLSI Syst., Vol. 9, No. 6, pp. 899-912, December 2001.
5. J. A. Davis, et al., IEEE Trans. Electron Devices, pp. 580-597. March 1998.
6. R. Sarvari and J. D. Meindl, IITC 2003, pp 42-44.